APA (7th ed.) Citation

Sharma, V. P., & Datla, N. V. (2022). Effect of bond-line thickness and mode-mixity on the fracture behavior and traction separation law of Sn-0.7Cu solder joints. Engineering Failure Analysis, 131, N.PAG. https://doi.org/10.1016/j.engfailanal.2021.105855

Chicago Style (17th ed.) Citation

Sharma, Ved Prakash, and Naresh V. Datla. "Effect of Bond-line Thickness and Mode-mixity on the Fracture Behavior and Traction Separation Law of Sn-0.7Cu Solder Joints." Engineering Failure Analysis 131 (2022): N.PAG. https://doi.org/10.1016/j.engfailanal.2021.105855.

MLA (9th ed.) Citation

Sharma, Ved Prakash, and Naresh V. Datla. "Effect of Bond-line Thickness and Mode-mixity on the Fracture Behavior and Traction Separation Law of Sn-0.7Cu Solder Joints." Engineering Failure Analysis, vol. 131, 2022, p. N.PAG, https://doi.org/10.1016/j.engfailanal.2021.105855.