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Study of Temperature Dependence of Bump Bonding for the BTeV Pixel Detector.

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Title: Study of Temperature Dependence of Bump Bonding for the BTeV Pixel Detector.
Authors: Thrqueti, M.1 turqueti@fnal.gov, Cihangir, S.1, Kwan, S.1, Appel, J. A.1, Cardoso, G.1, Christian, D. C.1, Hall, B. K.1, Zimmermann, S.1
Source: IEEE Transactions on Nuclear Science. Oct2004 Part 1 of 4, Vol. 51 Issue 5, p2161-2167. 7p.
Subjects: Silicon, Detectors, Sealing (Technology), Native element minerals, Engineering instruments, Solder & soldering
Abstract: The pixel detector proposed for the BTeV experiment at the Fermilab Tevatron will use bump-bonding technology based on either Indium or Pb/Sn solder to connect the front-end readout chips to the silicon pixel sensors. We have studied the behavior of the bumps by visual inspection of the bumps bonding silicon sensor modules to dummy chips made out of glass. The studies were done before and after thermal cycles, exposure to intense irradiation, and with the assemblies glued to a graphite substrate. We have also carried out studies on effects of temperature changes on both types of bump bonds by observing the responses of single-chip pixel detectors to a 90Sr source. We report the results from these studies as well as the noise and threshold behavior of the pixel readout at various temperatures. [ABSTRACT FROM AUTHOR]
Copyright of IEEE Transactions on Nuclear Science is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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Header DbId: egs
DbLabel: Engineering Source
An: 16259980
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Study of Temperature Dependence of Bump Bonding for the BTeV Pixel Detector.
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  Data: <searchLink fieldCode="JN" term="%22IEEE+Transactions+on+Nuclear+Science%22">IEEE Transactions on Nuclear Science</searchLink>. Oct2004 Part 1 of 4, Vol. 51 Issue 5, p2161-2167. 7p.
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  Data: <searchLink fieldCode="DE" term="%22Silicon%22">Silicon</searchLink><br /><searchLink fieldCode="DE" term="%22Detectors%22">Detectors</searchLink><br /><searchLink fieldCode="DE" term="%22Sealing+%28Technology%29%22">Sealing (Technology)</searchLink><br /><searchLink fieldCode="DE" term="%22Native+element+minerals%22">Native element minerals</searchLink><br /><searchLink fieldCode="DE" term="%22Engineering+instruments%22">Engineering instruments</searchLink><br /><searchLink fieldCode="DE" term="%22Solder+%26+soldering%22">Solder & soldering</searchLink>
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  Data: The pixel detector proposed for the BTeV experiment at the Fermilab Tevatron will use bump-bonding technology based on either Indium or Pb/Sn solder to connect the front-end readout chips to the silicon pixel sensors. We have studied the behavior of the bumps by visual inspection of the bumps bonding silicon sensor modules to dummy chips made out of glass. The studies were done before and after thermal cycles, exposure to intense irradiation, and with the assemblies glued to a graphite substrate. We have also carried out studies on effects of temperature changes on both types of bump bonds by observing the responses of single-chip pixel detectors to a 90Sr source. We report the results from these studies as well as the noise and threshold behavior of the pixel readout at various temperatures. [ABSTRACT FROM AUTHOR]
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  Data: <i>Copyright of IEEE Transactions on Nuclear Science is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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        Value: 10.1109/TNS.2004.834709
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        Text: English
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      – SubjectFull: Detectors
        Type: general
      – SubjectFull: Sealing (Technology)
        Type: general
      – SubjectFull: Native element minerals
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      – SubjectFull: Engineering instruments
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      – SubjectFull: Solder & soldering
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              Text: Oct2004 Part 1 of 4
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