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Fundamentals of thin film depth profiling by glow discharge optical emission spectroscopy.

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Title: Fundamentals of thin film depth profiling by glow discharge optical emission spectroscopy.
Authors: Vesel, Alenka1 (AUTHOR), Zaplotnik, Rok1 (AUTHOR), Primc, Gregor1 (AUTHOR), Mozetic, Miran1 (AUTHOR) miran.mozetic@guest.arnes.si
Source: Journal of Vacuum Science & Technology: Part A-Vacuums, Surfaces & Films. Jul2023, Vol. 41 Issue 4, p1-12. 12p.
Subjects: Glow discharges, Emission spectroscopy, Optical spectroscopy, Depth profiling, Thin films, Plasma gases
Abstract: Glow discharge optical emission spectroscopy (GDOES) is a useful technique for qualitative plasma characterization. It also enables depth profiling of solid materials upon exposure of samples to energetic positively charged ions from gaseous plasma, providing specifics of both surface- and gas-phase collision phenomena that are considered. The early stages of developing GDOES useful for the determination of surface composition and depth profiling of solid materials are reviewed and analyzed, stressing the contribution of early authors. The advantages as well as drawbacks of the GDOES technique are presented and discussed. The recent applications of this technique for depth profiling of various materials are presented, and the directions for constructing a laboratory-scale device are provided. [ABSTRACT FROM AUTHOR]
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Database: Engineering Source
Description
Abstract:Glow discharge optical emission spectroscopy (GDOES) is a useful technique for qualitative plasma characterization. It also enables depth profiling of solid materials upon exposure of samples to energetic positively charged ions from gaseous plasma, providing specifics of both surface- and gas-phase collision phenomena that are considered. The early stages of developing GDOES useful for the determination of surface composition and depth profiling of solid materials are reviewed and analyzed, stressing the contribution of early authors. The advantages as well as drawbacks of the GDOES technique are presented and discussed. The recent applications of this technique for depth profiling of various materials are presented, and the directions for constructing a laboratory-scale device are provided. [ABSTRACT FROM AUTHOR]
ISSN:07342101
DOI:10.1116/6.0002695