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Characterizing of a unique Al/Cu FGMMC fabricated via the ARB-CRB process followed by annealing.

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Title: Characterizing of a unique Al/Cu FGMMC fabricated via the ARB-CRB process followed by annealing.
Authors: Tayyebi, Moslem1 (AUTHOR) moslemtayyebi1990@gmail.com, Alizadeh, Morteza1 (AUTHOR) Alizadeh@sutech.ac.ir, Lech, Sebastian2 (AUTHOR)
Source: Journal of Alloys & Compounds. Sep2024, Vol. 1000, pN.PAG-N.PAG. 1p.
Subjects: Copper, Metallic composites, Tensile strength, Functionally gradient materials, Tensile tests
Abstract: This study investigates the influence of different annealing temperatures on the microstructure and growth of the intermetallic phase in an Al/Cu functionally graded metal matrix composite (FGMMC (produced by the accumulative roll bonding (ARB)-cold roll bonding (CRB) process. SEM images show the evolving distribution of Cu content in the composite, with the finest and thinnest Cu layer observed in the Al/20Cu region. The annealing at 400°C and 450°C for 2, 4, and 6 hours results in the formation of intermetallic layers (Al 2 Cu, Al 4 Cu 9 , and AlCu) with a clear progression from the Al side to the Cu side, as confirmed by SEM-EDS and TEM analysis. Increasing the annealing conditions increases the thickness of the intermetallic layers. In addition, the intermetallic layers are thicker in the FGMMC sample than in the ARB sample under the same conditions due to the additional strain during the process. The findings demonstrate that a diffusion-controlled mechanism governs the growth of the Al 2 Cu, Al 4 Cu 9 , and AlCu layers. The tensile test results indicate that as the Cu content increases from 20 wt% to 80 wt%, the ultimate tensile strength of the layers increases from 288.24 MPa to 373.66 MPa, while the elongation decreases from 8.2 % to 5.3 %. After annealing, however, these values decreased due to the restoration phenomenon and intermetallic formation. The fracture surface predominantly exhibits a brittle mode, especially with increasing Cu content and annealing conditions. • The Al/Cu FGMMC was fabricated by a new procedure consisting of ARB and CRB processes. • The copper layers were well distributed across the microstructure due to applying high strains. • With an increase in Cu content, the tensile strength increased and elongation decreased. • The formation sequence of the IMC layers was Al 2 Cu, Al 4 Cu 9 , and AlCu. The growth of IMCs is mainly controlled by diffusion. [ABSTRACT FROM AUTHOR]
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Database: Engineering Source
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Abstract:This study investigates the influence of different annealing temperatures on the microstructure and growth of the intermetallic phase in an Al/Cu functionally graded metal matrix composite (FGMMC (produced by the accumulative roll bonding (ARB)-cold roll bonding (CRB) process. SEM images show the evolving distribution of Cu content in the composite, with the finest and thinnest Cu layer observed in the Al/20Cu region. The annealing at 400°C and 450°C for 2, 4, and 6 hours results in the formation of intermetallic layers (Al 2 Cu, Al 4 Cu 9 , and AlCu) with a clear progression from the Al side to the Cu side, as confirmed by SEM-EDS and TEM analysis. Increasing the annealing conditions increases the thickness of the intermetallic layers. In addition, the intermetallic layers are thicker in the FGMMC sample than in the ARB sample under the same conditions due to the additional strain during the process. The findings demonstrate that a diffusion-controlled mechanism governs the growth of the Al 2 Cu, Al 4 Cu 9 , and AlCu layers. The tensile test results indicate that as the Cu content increases from 20 wt% to 80 wt%, the ultimate tensile strength of the layers increases from 288.24 MPa to 373.66 MPa, while the elongation decreases from 8.2 % to 5.3 %. After annealing, however, these values decreased due to the restoration phenomenon and intermetallic formation. The fracture surface predominantly exhibits a brittle mode, especially with increasing Cu content and annealing conditions. • The Al/Cu FGMMC was fabricated by a new procedure consisting of ARB and CRB processes. • The copper layers were well distributed across the microstructure due to applying high strains. • With an increase in Cu content, the tensile strength increased and elongation decreased. • The formation sequence of the IMC layers was Al 2 Cu, Al 4 Cu 9 , and AlCu. The growth of IMCs is mainly controlled by diffusion. [ABSTRACT FROM AUTHOR]
ISSN:09258388
DOI:10.1016/j.jallcom.2024.175045