NONDESTRUCTIVE 3D X-RAY MICROSCOPY SPEEDS THROUGHPUT IN NEW FAILURE ANALYSIS WORKFLOWS.

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Bibliographic Details
Title:	NONDESTRUCTIVE 3D X-RAY MICROSCOPY SPEEDS THROUGHPUT IN NEW FAILURE ANALYSIS WORKFLOWS.
Authors:	Hartfield, Cheryl¹ cheryl.hartfield@zeiss.com
Source:	Electronic Device Failure Analysis. Nov2024, Vol. 26 Issue 4, p14-19. 6p.
Subjects:	Failure analysis, X-ray microscopy, High performance computing
Abstract:	The article focuses on the growing demand for high-performance computing (HPC) driven by artificial intelligence and machine learning, leading to complex packaging challenges. Topics include the rise of heterogeneous integration and chiplet architectures, the application of 3D x-ray microscopy for nondestructive failure analysis, and the integration of AI models to enhance fault detection and process validation.
Database:	Engineering Source

Description
Abstract:	The article focuses on the growing demand for high-performance computing (HPC) driven by artificial intelligence and machine learning, leading to complex packaging challenges. Topics include the rise of heterogeneous integration and chiplet architectures, the application of 3D x-ray microscopy for nondestructive failure analysis, and the integration of AI models to enhance fault detection and process validation.
ISSN:	15370755
DOI:	10.31399/asm.edfa.2024-4.p014