APA (7th ed.) Citation

Hartfield, C. (2024). NONDESTRUCTIVE 3D X-RAY MICROSCOPY SPEEDS THROUGHPUT IN NEW FAILURE ANALYSIS WORKFLOWS. Electronic Device Failure Analysis, 26(4), 14. https://doi.org/10.31399/asm.edfa.2024-4.p014

Chicago Style (17th ed.) Citation

Hartfield, Cheryl. "NONDESTRUCTIVE 3D X-RAY MICROSCOPY SPEEDS THROUGHPUT IN NEW FAILURE ANALYSIS WORKFLOWS." Electronic Device Failure Analysis 26, no. 4 (2024): 14. https://doi.org/10.31399/asm.edfa.2024-4.p014.

MLA (9th ed.) Citation

Hartfield, Cheryl. "NONDESTRUCTIVE 3D X-RAY MICROSCOPY SPEEDS THROUGHPUT IN NEW FAILURE ANALYSIS WORKFLOWS." Electronic Device Failure Analysis, vol. 26, no. 4, 2024, p. 14, https://doi.org/10.31399/asm.edfa.2024-4.p014.