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NONDESTRUCTIVE 3D X-RAY MICROSCOPY SPEEDS THROUGHPUT IN NEW FAILURE ANALYSIS WORKFLOWS.

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Title: NONDESTRUCTIVE 3D X-RAY MICROSCOPY SPEEDS THROUGHPUT IN NEW FAILURE ANALYSIS WORKFLOWS.
Authors: Hartfield, Cheryl1 cheryl.hartfield@zeiss.com
Source: Electronic Device Failure Analysis. Nov2024, Vol. 26 Issue 4, p14-19. 6p.
Subjects: Failure analysis, X-ray microscopy, High performance computing
Abstract: The article focuses on the growing demand for high-performance computing (HPC) driven by artificial intelligence and machine learning, leading to complex packaging challenges. Topics include the rise of heterogeneous integration and chiplet architectures, the application of 3D x-ray microscopy for nondestructive failure analysis, and the integration of AI models to enhance fault detection and process validation.
Database: Engineering Source
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Header DbId: egs
DbLabel: Engineering Source
An: 180438660
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: NONDESTRUCTIVE 3D X-RAY MICROSCOPY SPEEDS THROUGHPUT IN NEW FAILURE ANALYSIS WORKFLOWS.
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  Data: <searchLink fieldCode="AR" term="%22Hartfield%2C+Cheryl%22">Hartfield, Cheryl</searchLink><relatesTo>1</relatesTo><i> cheryl.hartfield@zeiss.com</i>
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  Data: <searchLink fieldCode="JN" term="%22Electronic+Device+Failure+Analysis%22">Electronic Device Failure Analysis</searchLink>. Nov2024, Vol. 26 Issue 4, p14-19. 6p.
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  Data: <searchLink fieldCode="DE" term="%22Failure+analysis%22">Failure analysis</searchLink><br /><searchLink fieldCode="DE" term="%22X-ray+microscopy%22">X-ray microscopy</searchLink><br /><searchLink fieldCode="DE" term="%22High+performance+computing%22">High performance computing</searchLink>
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  Data: The article focuses on the growing demand for high-performance computing (HPC) driven by artificial intelligence and machine learning, leading to complex packaging challenges. Topics include the rise of heterogeneous integration and chiplet architectures, the application of 3D x-ray microscopy for nondestructive failure analysis, and the integration of AI models to enhance fault detection and process validation.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=180438660
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.31399/asm.edfa.2024-4.p014
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      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 6
        StartPage: 14
    Subjects:
      – SubjectFull: Failure analysis
        Type: general
      – SubjectFull: X-ray microscopy
        Type: general
      – SubjectFull: High performance computing
        Type: general
    Titles:
      – TitleFull: NONDESTRUCTIVE 3D X-RAY MICROSCOPY SPEEDS THROUGHPUT IN NEW FAILURE ANALYSIS WORKFLOWS.
        Type: main
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          Name:
            NameFull: Hartfield, Cheryl
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            – D: 01
              M: 11
              Text: Nov2024
              Type: published
              Y: 2024
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            – Type: issn-print
              Value: 15370755
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              Value: 26
            – Type: issue
              Value: 4
          Titles:
            – TitleFull: Electronic Device Failure Analysis
              Type: main
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