Metastable Fine Grain Cu for Hybrid Bonding Applications.

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Bibliographic Details
Title:	Metastable Fine Grain Cu for Hybrid Bonding Applications.
Authors:	Pingping Ye¹ pingping.ye@macdermidalpha.com, Jianwen Han¹, Braye, Stephan¹, ElSawy, Abdelhamid¹, Khanna, Harshul¹, Hayes, Veronica¹, Letize, Adam¹, Whitten, Kyle¹, Richardson, Thomas¹, Najjar, Elie¹
Source:	Advancing Microelectronics. 2024, Vol. 51 Issue 5, p6-9. 4p.
Subjects:	Hybrid securities, Copper, Temperature
Abstract:	Utilizing metastable fine-grain copper offers an opportunity to implement low-thermal budget hybrid bonding techniques. We outline several methods for characterizing fine-grain structures and a screening process to refine these structures. Furthermore, we explore the differences in copper grain evolution between blanket and patterned wafers at room temperature. Finally, we introduce metastable fine-grain copper, which demonstrates stability for four weeks of self-annealing and maintains stability through annealing at 150°C for 2 hours, with grain growth occurring at 250°C. The capability to maintain fine-grain copper over an extended period presents a promising solution for low-thermal budget hybrid bonding. [ABSTRACT FROM AUTHOR]
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Database:	Engineering Source

Description
Abstract:	Utilizing metastable fine-grain copper offers an opportunity to implement low-thermal budget hybrid bonding techniques. We outline several methods for characterizing fine-grain structures and a screening process to refine these structures. Furthermore, we explore the differences in copper grain evolution between blanket and patterned wafers at room temperature. Finally, we introduce metastable fine-grain copper, which demonstrates stability for four weeks of self-annealing and maintains stability through annealing at 150°C for 2 hours, with grain growth occurring at 250°C. The capability to maintain fine-grain copper over an extended period presents a promising solution for low-thermal budget hybrid bonding. [ABSTRACT FROM AUTHOR]
ISSN:	23807008