View in EDS PDF Full Text

Metastable Fine Grain Cu for Hybrid Bonding Applications.

Saved in:
Bibliographic Details
Title: Metastable Fine Grain Cu for Hybrid Bonding Applications.
Authors: Pingping Ye1 pingping.ye@macdermidalpha.com, Jianwen Han1, Braye, Stephan1, ElSawy, Abdelhamid1, Khanna, Harshul1, Hayes, Veronica1, Letize, Adam1, Whitten, Kyle1, Richardson, Thomas1, Najjar, Elie1
Source: Advancing Microelectronics. 2024, Vol. 51 Issue 5, p6-9. 4p.
Subjects: Hybrid securities, Copper, Temperature
Abstract: Utilizing metastable fine-grain copper offers an opportunity to implement low-thermal budget hybrid bonding techniques. We outline several methods for characterizing fine-grain structures and a screening process to refine these structures. Furthermore, we explore the differences in copper grain evolution between blanket and patterned wafers at room temperature. Finally, we introduce metastable fine-grain copper, which demonstrates stability for four weeks of self-annealing and maintains stability through annealing at 150°C for 2 hours, with grain growth occurring at 250°C. The capability to maintain fine-grain copper over an extended period presents a promising solution for low-thermal budget hybrid bonding. [ABSTRACT FROM AUTHOR]
Copyright of Advancing Microelectronics is the property of International Microelectronics & Packaging Society and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
FullText Links:
  – Type: pdflink
Text:
  Availability: 0
Header DbId: egs
DbLabel: Engineering Source
An: 181265616
AccessLevel: 6
PubType: Periodical
PubTypeId: serialPeriodical
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: Metastable Fine Grain Cu for Hybrid Bonding Applications.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Pingping+Ye%22">Pingping Ye</searchLink><relatesTo>1</relatesTo><i> pingping.ye@macdermidalpha.com</i><br /><searchLink fieldCode="AR" term="%22Jianwen+Han%22">Jianwen Han</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Braye%2C+Stephan%22">Braye, Stephan</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22ElSawy%2C+Abdelhamid%22">ElSawy, Abdelhamid</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Khanna%2C+Harshul%22">Khanna, Harshul</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Hayes%2C+Veronica%22">Hayes, Veronica</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Letize%2C+Adam%22">Letize, Adam</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Whitten%2C+Kyle%22">Whitten, Kyle</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Richardson%2C+Thomas%22">Richardson, Thomas</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Najjar%2C+Elie%22">Najjar, Elie</searchLink><relatesTo>1</relatesTo>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Advancing+Microelectronics%22">Advancing Microelectronics</searchLink>. 2024, Vol. 51 Issue 5, p6-9. 4p.
– Name: Subject
  Label: Subjects
  Group: Su
  Data: <searchLink fieldCode="DE" term="%22Hybrid+securities%22">Hybrid securities</searchLink><br /><searchLink fieldCode="DE" term="%22Copper%22">Copper</searchLink><br /><searchLink fieldCode="DE" term="%22Temperature%22">Temperature</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: Utilizing metastable fine-grain copper offers an opportunity to implement low-thermal budget hybrid bonding techniques. We outline several methods for characterizing fine-grain structures and a screening process to refine these structures. Furthermore, we explore the differences in copper grain evolution between blanket and patterned wafers at room temperature. Finally, we introduce metastable fine-grain copper, which demonstrates stability for four weeks of self-annealing and maintains stability through annealing at 150°C for 2 hours, with grain growth occurring at 250°C. The capability to maintain fine-grain copper over an extended period presents a promising solution for low-thermal budget hybrid bonding. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Advancing Microelectronics is the property of International Microelectronics & Packaging Society and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=181265616
RecordInfo BibRecord:
  BibEntity:
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 4
        StartPage: 6
    Subjects:
      – SubjectFull: Hybrid securities
        Type: general
      – SubjectFull: Copper
        Type: general
      – SubjectFull: Temperature
        Type: general
    Titles:
      – TitleFull: Metastable Fine Grain Cu for Hybrid Bonding Applications.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Pingping Ye
      – PersonEntity:
          Name:
            NameFull: Jianwen Han
      – PersonEntity:
          Name:
            NameFull: Braye, Stephan
      – PersonEntity:
          Name:
            NameFull: ElSawy, Abdelhamid
      – PersonEntity:
          Name:
            NameFull: Khanna, Harshul
      – PersonEntity:
          Name:
            NameFull: Hayes, Veronica
      – PersonEntity:
          Name:
            NameFull: Letize, Adam
      – PersonEntity:
          Name:
            NameFull: Whitten, Kyle
      – PersonEntity:
          Name:
            NameFull: Richardson, Thomas
      – PersonEntity:
          Name:
            NameFull: Najjar, Elie
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 09
              Text: 2024
              Type: published
              Y: 2024
          Identifiers:
            – Type: issn-print
              Value: 23807008
          Numbering:
            – Type: volume
              Value: 51
            – Type: issue
              Value: 5
          Titles:
            – TitleFull: Advancing Microelectronics
              Type: main
ResultId 1