Design and Architecture De!nition for Advanced 3D Fan-Out Wafer-Level Packaging.

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Bibliographic Details
Title:	Design and Architecture De!nition for Advanced 3D Fan-Out Wafer-Level Packaging.
Authors:	Bhangaonkar, Karan¹ karan.r.bhangaonkar@intel.com, Sankarasubramanian, Santosh¹
Source:	Journal of Microelectronic & Electronic Packaging. 2024, Vol. 21 Issue 3, p59-66. 8p.
Subjects:	Wafer level packaging, Three-dimensional imaging, Acquisition of data, Computer architecture, Thermal expansion
Abstract:	Advanced 2.5D/3D wafer-level fan-out packaging technologies have been studied widely in literature and industry in recent years. Miniaturization, reduction in manufacturing costs, improvement in performance, and lower power consumption using packaging technologies drive increase in interconnect density and pitch scaling. Heterogeneous systems in package used in advanced packaging often include a combination of silicon, epoxy under!ll or mold compounds, and organic or inorganic passivation or redistribution layers. This heterogeneity poses challenges with manufacturability, process selection, package architecture, and test vehicle design. The coefficient of thermal expansion mismatch, wafer warpage, and wafer yield are some of the critical process challenges. Delamination of silicon side wall or passivation to epoxy underfill or mold compound, joint fatigue are critical reliability challenges. This article explores various processes and reliability challenges with 3D wafer-level fan-out packaging and provides package design and architecture guidelines to overcome these failure modes. Stacked die-to-wafer test vehicles have been used for data collection. Different assembly materials, processes, and tooling have been evaluated to de!ne comprehensive design rules. [ABSTRACT FROM AUTHOR]
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Database:	Engineering Source

Description
Abstract:	Advanced 2.5D/3D wafer-level fan-out packaging technologies have been studied widely in literature and industry in recent years. Miniaturization, reduction in manufacturing costs, improvement in performance, and lower power consumption using packaging technologies drive increase in interconnect density and pitch scaling. Heterogeneous systems in package used in advanced packaging often include a combination of silicon, epoxy under!ll or mold compounds, and organic or inorganic passivation or redistribution layers. This heterogeneity poses challenges with manufacturability, process selection, package architecture, and test vehicle design. The coefficient of thermal expansion mismatch, wafer warpage, and wafer yield are some of the critical process challenges. Delamination of silicon side wall or passivation to epoxy underfill or mold compound, joint fatigue are critical reliability challenges. This article explores various processes and reliability challenges with 3D wafer-level fan-out packaging and provides package design and architecture guidelines to overcome these failure modes. Stacked die-to-wafer test vehicles have been used for data collection. Different assembly materials, processes, and tooling have been evaluated to de!ne comprehensive design rules. [ABSTRACT FROM AUTHOR]
ISSN:	15514897
DOI:	10.4071/001c.124087