APA (7th ed.) Citation

Bhangaonkar, K., & Sankarasubramanian, S. (2024). Design and Architecture De!nition for Advanced 3D Fan-Out Wafer-Level Packaging. Journal of Microelectronic & Electronic Packaging, 21(3), 59. https://doi.org/10.4071/001c.124087

Chicago Style (17th ed.) Citation

Bhangaonkar, Karan, and Santosh Sankarasubramanian. "Design and Architecture De!nition for Advanced 3D Fan-Out Wafer-Level Packaging." Journal of Microelectronic & Electronic Packaging 21, no. 3 (2024): 59. https://doi.org/10.4071/001c.124087.

MLA (9th ed.) Citation

Bhangaonkar, Karan, and Santosh Sankarasubramanian. "Design and Architecture De!nition for Advanced 3D Fan-Out Wafer-Level Packaging." Journal of Microelectronic & Electronic Packaging, vol. 21, no. 3, 2024, p. 59, https://doi.org/10.4071/001c.124087.