View in EDS

Thermal management enhancement of electronic chips based on novel technologies.

Saved in:
Bibliographic Details
Title: Thermal management enhancement of electronic chips based on novel technologies.
Authors: Chen, Haopeng1,2 (AUTHOR), Zhang, Tianshi1,2 (AUTHOR) zhangtianshi@jlu.edu.cn, Gao, Qing1,2 (AUTHOR), Lv, Jianwei3 (AUTHOR), Chen, Haibo1,2 (AUTHOR) chenhb@jlu.edu.cn, Huang, Haizhen1,2 (AUTHOR)
Source: Energy. Feb2025, Vol. 316, pN.PAG-N.PAG. 1p.
Subjects: Heat transfer, Latent heat, Heat capacity, Cooling, Machine learning
Abstract: As the characteristic size continue to decrease and integration and output power continue to increase, the heat flow density of electronic chips and the risk of thermal failure increase dramatically. Effectively dissipating the heat generated during the working process of electronic chips and realizing efficient thermal management under high heat flow density conditions has become a focal point of interest for both academia and industry. This paper focuses on the embedded microchannel two-phase cooling technology. It analyzes and summarizes the latest technological and research advances in industry and academia in the field of thermal management of electronic chips from three aspects: embedded cooling, microchannel cooling, and two-phase cooling. It sorts out the logical relationship between these three perspectives, and combs through the key scientific issues, bottlenecks and challenges, and future development directions and prospects. First, there is a move from non-embedded cooling to embedded cooling. The heat dissipation capacity is gradually increasing from 200 W/cm2 to more than 1000 W/cm2. Second, there is a move from conventional channels to microchannels. Hydraulic diameters gradually shrinking to 3 mm, 200 μm, 1 μm, and even within 1 μm. Finally, there is a move from single-phase cooling to two-phase cooling. Utilizing the latent heat of phase change to further enhance the heat transfer efficiency. We believe that in the future, the design of microchannel structure and the optimization of heat transfer surface can be fully integrated with bionics, adaptive regulation, machine learning, and other novel technologies to further achieve heat transfer enhancement and improve the potential of thermal management of electronic chips. • Combing through key issues in fields of thermal management of electronic chips. • Analyzing advances from three aspects: embedded, microchannel, and two-phase cooling. • Sorting out the logical relationship between different cooling methods. • Pointing out bottlenecks, challenges, future development directions and prospects. • Utilizing bionics to further improve the potential of thermal management. [ABSTRACT FROM AUTHOR]
Copyright of Energy is the property of Pergamon Press - An Imprint of Elsevier Science and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
FullText Text:
  Availability: 0
Header DbId: egs
DbLabel: Engineering Source
An: 182502421
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: Thermal management enhancement of electronic chips based on novel technologies.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Chen%2C+Haopeng%22">Chen, Haopeng</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Zhang%2C+Tianshi%22">Zhang, Tianshi</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<i> zhangtianshi@jlu.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Gao%2C+Qing%22">Gao, Qing</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Lv%2C+Jianwei%22">Lv, Jianwei</searchLink><relatesTo>3</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Chen%2C+Haibo%22">Chen, Haibo</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<i> chenhb@jlu.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Huang%2C+Haizhen%22">Huang, Haizhen</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Energy%22">Energy</searchLink>. Feb2025, Vol. 316, pN.PAG-N.PAG. 1p.
– Name: Subject
  Label: Subjects
  Group: Su
  Data: <searchLink fieldCode="DE" term="%22Heat+transfer%22">Heat transfer</searchLink><br /><searchLink fieldCode="DE" term="%22Latent+heat%22">Latent heat</searchLink><br /><searchLink fieldCode="DE" term="%22Heat+capacity%22">Heat capacity</searchLink><br /><searchLink fieldCode="DE" term="%22Cooling%22">Cooling</searchLink><br /><searchLink fieldCode="DE" term="%22Machine+learning%22">Machine learning</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: As the characteristic size continue to decrease and integration and output power continue to increase, the heat flow density of electronic chips and the risk of thermal failure increase dramatically. Effectively dissipating the heat generated during the working process of electronic chips and realizing efficient thermal management under high heat flow density conditions has become a focal point of interest for both academia and industry. This paper focuses on the embedded microchannel two-phase cooling technology. It analyzes and summarizes the latest technological and research advances in industry and academia in the field of thermal management of electronic chips from three aspects: embedded cooling, microchannel cooling, and two-phase cooling. It sorts out the logical relationship between these three perspectives, and combs through the key scientific issues, bottlenecks and challenges, and future development directions and prospects. First, there is a move from non-embedded cooling to embedded cooling. The heat dissipation capacity is gradually increasing from 200 W/cm2 to more than 1000 W/cm2. Second, there is a move from conventional channels to microchannels. Hydraulic diameters gradually shrinking to 3 mm, 200 μm, 1 μm, and even within 1 μm. Finally, there is a move from single-phase cooling to two-phase cooling. Utilizing the latent heat of phase change to further enhance the heat transfer efficiency. We believe that in the future, the design of microchannel structure and the optimization of heat transfer surface can be fully integrated with bionics, adaptive regulation, machine learning, and other novel technologies to further achieve heat transfer enhancement and improve the potential of thermal management of electronic chips. • Combing through key issues in fields of thermal management of electronic chips. • Analyzing advances from three aspects: embedded, microchannel, and two-phase cooling. • Sorting out the logical relationship between different cooling methods. • Pointing out bottlenecks, challenges, future development directions and prospects. • Utilizing bionics to further improve the potential of thermal management. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Energy is the property of Pergamon Press - An Imprint of Elsevier Science and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=182502421
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1016/j.energy.2025.134575
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 1
        StartPage: N.PAG
    Subjects:
      – SubjectFull: Heat transfer
        Type: general
      – SubjectFull: Latent heat
        Type: general
      – SubjectFull: Heat capacity
        Type: general
      – SubjectFull: Cooling
        Type: general
      – SubjectFull: Machine learning
        Type: general
    Titles:
      – TitleFull: Thermal management enhancement of electronic chips based on novel technologies.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Chen, Haopeng
      – PersonEntity:
          Name:
            NameFull: Zhang, Tianshi
      – PersonEntity:
          Name:
            NameFull: Gao, Qing
      – PersonEntity:
          Name:
            NameFull: Lv, Jianwei
      – PersonEntity:
          Name:
            NameFull: Chen, Haibo
      – PersonEntity:
          Name:
            NameFull: Huang, Haizhen
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 02
              Text: Feb2025
              Type: published
              Y: 2025
          Identifiers:
            – Type: issn-print
              Value: 03605442
          Numbering:
            – Type: volume
              Value: 316
          Titles:
            – TitleFull: Energy
              Type: main
ResultId 1