Transient Liquid-Phase Bonding Using Sn/Ni/Sn Laminated Metal Preform for Power Device Packaging.
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| Title: | Transient Liquid-Phase Bonding Using Sn/Ni/Sn Laminated Metal Preform for Power Device Packaging. |
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| Authors: | Lee, Dong-Bok1 (AUTHOR), Seo, Young-Jin1 (AUTHOR), Yoon, Jeong-Won1 (AUTHOR) jwyoon@chungbuk.ac.kr |
| Source: | Journal of Electronic Materials. Mar2025, Vol. 54 Issue 3, p1592-1601. 10p. |
| Subjects: | Intermetallic compounds, Metal microstructure, Electronic packaging, Scanning electron microscopy, Time pressure, X-ray emission spectroscopy |
| Abstract: | Intermetallic compound (IMC) joints formed via transient liquid-phase (TLP) bonding offer excellent high-temperature durability. However, IMC formation at the joint requires long bonding times and high pressures. In this study, to reduce the bonding time and pressure required for IMC formation, a Sn/Ni/Sn laminated metal preform was fabricated by inserting Ni foil between Sn foils, and this material was used to bond a chip to a substrate. The microstructure of the joint cross-section was analyzed using field-emission scanning electron microscopy and energy-dispersive x-ray spectroscopy. The Sn foil was completely converted to 7 μm Ni3Sn4 within 15 min, forming a stable TLP-bonded joint. After bonding, a shear test was conducted to evaluate the mechanical properties of the joints, which revealed high shear strength, exceeding 46 MPa. [ABSTRACT FROM AUTHOR] |
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| Database: | Engineering Source |
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| Abstract: | Intermetallic compound (IMC) joints formed via transient liquid-phase (TLP) bonding offer excellent high-temperature durability. However, IMC formation at the joint requires long bonding times and high pressures. In this study, to reduce the bonding time and pressure required for IMC formation, a Sn/Ni/Sn laminated metal preform was fabricated by inserting Ni foil between Sn foils, and this material was used to bond a chip to a substrate. The microstructure of the joint cross-section was analyzed using field-emission scanning electron microscopy and energy-dispersive x-ray spectroscopy. The Sn foil was completely converted to 7 μm Ni3Sn4 within 15 min, forming a stable TLP-bonded joint. After bonding, a shear test was conducted to evaluate the mechanical properties of the joints, which revealed high shear strength, exceeding 46 MPa. [ABSTRACT FROM AUTHOR] |
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| ISSN: | 03615235 |
| DOI: | 10.1007/s11664-025-11738-5 |
