APA (7th ed.) Citation

Lee, D., Seo, Y., & Yoon, J. (2025). Transient Liquid-Phase Bonding Using Sn/Ni/Sn Laminated Metal Preform for Power Device Packaging. Journal of Electronic Materials, 54(3), 1592. https://doi.org/10.1007/s11664-025-11738-5

Chicago Style (17th ed.) Citation

Lee, Dong-Bok, Young-Jin Seo, and Jeong-Won Yoon. "Transient Liquid-Phase Bonding Using Sn/Ni/Sn Laminated Metal Preform for Power Device Packaging." Journal of Electronic Materials 54, no. 3 (2025): 1592. https://doi.org/10.1007/s11664-025-11738-5.

MLA (9th ed.) Citation

Lee, Dong-Bok, et al. "Transient Liquid-Phase Bonding Using Sn/Ni/Sn Laminated Metal Preform for Power Device Packaging." Journal of Electronic Materials, vol. 54, no. 3, 2025, p. 1592, https://doi.org/10.1007/s11664-025-11738-5.