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Transient Liquid-Phase Bonding Using Sn/Ni/Sn Laminated Metal Preform for Power Device Packaging.

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Title: Transient Liquid-Phase Bonding Using Sn/Ni/Sn Laminated Metal Preform for Power Device Packaging.
Authors: Lee, Dong-Bok1 (AUTHOR), Seo, Young-Jin1 (AUTHOR), Yoon, Jeong-Won1 (AUTHOR) jwyoon@chungbuk.ac.kr
Source: Journal of Electronic Materials. Mar2025, Vol. 54 Issue 3, p1592-1601. 10p.
Subjects: Intermetallic compounds, Metal microstructure, Electronic packaging, Scanning electron microscopy, Time pressure, X-ray emission spectroscopy
Abstract: Intermetallic compound (IMC) joints formed via transient liquid-phase (TLP) bonding offer excellent high-temperature durability. However, IMC formation at the joint requires long bonding times and high pressures. In this study, to reduce the bonding time and pressure required for IMC formation, a Sn/Ni/Sn laminated metal preform was fabricated by inserting Ni foil between Sn foils, and this material was used to bond a chip to a substrate. The microstructure of the joint cross-section was analyzed using field-emission scanning electron microscopy and energy-dispersive x-ray spectroscopy. The Sn foil was completely converted to 7 μm Ni3Sn4 within 15 min, forming a stable TLP-bonded joint. After bonding, a shear test was conducted to evaluate the mechanical properties of the joints, which revealed high shear strength, exceeding 46 MPa. [ABSTRACT FROM AUTHOR]
Copyright of Journal of Electronic Materials is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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  Data: Transient Liquid-Phase Bonding Using Sn/Ni/Sn Laminated Metal Preform for Power Device Packaging.
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  Data: <searchLink fieldCode="AR" term="%22Lee%2C+Dong-Bok%22">Lee, Dong-Bok</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Seo%2C+Young-Jin%22">Seo, Young-Jin</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Yoon%2C+Jeong-Won%22">Yoon, Jeong-Won</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> jwyoon@chungbuk.ac.kr</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>. Mar2025, Vol. 54 Issue 3, p1592-1601. 10p.
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  Data: <searchLink fieldCode="DE" term="%22Intermetallic+compounds%22">Intermetallic compounds</searchLink><br /><searchLink fieldCode="DE" term="%22Metal+microstructure%22">Metal microstructure</searchLink><br /><searchLink fieldCode="DE" term="%22Electronic+packaging%22">Electronic packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Scanning+electron+microscopy%22">Scanning electron microscopy</searchLink><br /><searchLink fieldCode="DE" term="%22Time+pressure%22">Time pressure</searchLink><br /><searchLink fieldCode="DE" term="%22X-ray+emission+spectroscopy%22">X-ray emission spectroscopy</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: Intermetallic compound (IMC) joints formed via transient liquid-phase (TLP) bonding offer excellent high-temperature durability. However, IMC formation at the joint requires long bonding times and high pressures. In this study, to reduce the bonding time and pressure required for IMC formation, a Sn/Ni/Sn laminated metal preform was fabricated by inserting Ni foil between Sn foils, and this material was used to bond a chip to a substrate. The microstructure of the joint cross-section was analyzed using field-emission scanning electron microscopy and energy-dispersive x-ray spectroscopy. The Sn foil was completely converted to 7 μm Ni3Sn4 within 15 min, forming a stable TLP-bonded joint. After bonding, a shear test was conducted to evaluate the mechanical properties of the joints, which revealed high shear strength, exceeding 46 MPa. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Journal of Electronic Materials is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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        Value: 10.1007/s11664-025-11738-5
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      – Code: eng
        Text: English
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        PageCount: 10
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      – SubjectFull: Intermetallic compounds
        Type: general
      – SubjectFull: Metal microstructure
        Type: general
      – SubjectFull: Electronic packaging
        Type: general
      – SubjectFull: Scanning electron microscopy
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      – SubjectFull: Time pressure
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      – SubjectFull: X-ray emission spectroscopy
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      – TitleFull: Transient Liquid-Phase Bonding Using Sn/Ni/Sn Laminated Metal Preform for Power Device Packaging.
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            NameFull: Lee, Dong-Bok
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            NameFull: Seo, Young-Jin
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            NameFull: Yoon, Jeong-Won
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            – D: 01
              M: 03
              Text: Mar2025
              Type: published
              Y: 2025
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