Soldering and Bonding in Contemporary Electronic Device Packaging.
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| Title: | Soldering and Bonding in Contemporary Electronic Device Packaging. |
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| Authors: | Li, Yuxuan1 (AUTHOR) panbei1981@126.com, Pan, Bei1,2 (AUTHOR), Ge, Zhenting1,3 (AUTHOR), Chen, Pengpeng1 (AUTHOR), Bi, Bo1,2 (AUTHOR), Yi, Xin1,3 (AUTHOR), Wu, Chaochao2 (AUTHOR) yu_xuan_li@yeah.net, Wang, Ce3 (AUTHOR) |
| Source: | Materials (1996-1944). May2025, Vol. 18 Issue 9, p2015. 19p. |
| Subjects: | Surface mount technology, Electronic packaging, Sealing (Technology), Electronic equipment, Copper, Semiconductor wafer bonding, Flip chip technology |
| Abstract: | Electronic packaging can transform the chip to a device for assembly. Soldering and bonding are important procedures in the process of electronic packaging. The continuous development of packaging architecture has driven the emergence of improved soldering and bonding processes. At the same time, conventional soldering and bonding processes are still widely used in device packaging. This paper introduces two kinds of technologies in wafer bonding, direct and indirect, expounds on five kinds of die attachment processes, and also describes the process of ball bonding and wedge bonding in wire bonding in detail. Flip chip bonding and methods for making bumps are also described in depth. Bump bonding processes are vital for 3D-SiP packages, and the bonding technology of copper bumps is a research hotspot in the field of advanced packaging. The surface mount technology and sealing technology used in some electronic devices are also briefly introduced. This paper provides insights for researchers studying soldering and bonding in contemporary electronic device packaging. [ABSTRACT FROM AUTHOR] |
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| Database: | Engineering Source |
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| Abstract: | Electronic packaging can transform the chip to a device for assembly. Soldering and bonding are important procedures in the process of electronic packaging. The continuous development of packaging architecture has driven the emergence of improved soldering and bonding processes. At the same time, conventional soldering and bonding processes are still widely used in device packaging. This paper introduces two kinds of technologies in wafer bonding, direct and indirect, expounds on five kinds of die attachment processes, and also describes the process of ball bonding and wedge bonding in wire bonding in detail. Flip chip bonding and methods for making bumps are also described in depth. Bump bonding processes are vital for 3D-SiP packages, and the bonding technology of copper bumps is a research hotspot in the field of advanced packaging. The surface mount technology and sealing technology used in some electronic devices are also briefly introduced. This paper provides insights for researchers studying soldering and bonding in contemporary electronic device packaging. [ABSTRACT FROM AUTHOR] |
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| ISSN: | 19961944 |
| DOI: | 10.3390/ma18092015 |
