APA (7th ed.) Citation

Li, Y., Pan, B., Ge, Z., Chen, P., Bi, B., Yi, X., . . . Wang, C. (2025). Soldering and Bonding in Contemporary Electronic Device Packaging. Materials (1996-1944), 18(9), 2015. https://doi.org/10.3390/ma18092015

Chicago Style (17th ed.) Citation

Li, Yuxuan, Bei Pan, Zhenting Ge, Pengpeng Chen, Bo Bi, Xin Yi, Chaochao Wu, and Ce Wang. "Soldering and Bonding in Contemporary Electronic Device Packaging." Materials (1996-1944) 18, no. 9 (2025): 2015. https://doi.org/10.3390/ma18092015.

MLA (9th ed.) Citation

Li, Yuxuan, et al. "Soldering and Bonding in Contemporary Electronic Device Packaging." Materials (1996-1944), vol. 18, no. 9, 2025, p. 2015, https://doi.org/10.3390/ma18092015.