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Soldering and Bonding in Contemporary Electronic Device Packaging.

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Title: Soldering and Bonding in Contemporary Electronic Device Packaging.
Authors: Li, Yuxuan1 (AUTHOR) panbei1981@126.com, Pan, Bei1,2 (AUTHOR), Ge, Zhenting1,3 (AUTHOR), Chen, Pengpeng1 (AUTHOR), Bi, Bo1,2 (AUTHOR), Yi, Xin1,3 (AUTHOR), Wu, Chaochao2 (AUTHOR) yu_xuan_li@yeah.net, Wang, Ce3 (AUTHOR)
Source: Materials (1996-1944). May2025, Vol. 18 Issue 9, p2015. 19p.
Subjects: Surface mount technology, Electronic packaging, Sealing (Technology), Electronic equipment, Copper, Semiconductor wafer bonding, Flip chip technology
Abstract: Electronic packaging can transform the chip to a device for assembly. Soldering and bonding are important procedures in the process of electronic packaging. The continuous development of packaging architecture has driven the emergence of improved soldering and bonding processes. At the same time, conventional soldering and bonding processes are still widely used in device packaging. This paper introduces two kinds of technologies in wafer bonding, direct and indirect, expounds on five kinds of die attachment processes, and also describes the process of ball bonding and wedge bonding in wire bonding in detail. Flip chip bonding and methods for making bumps are also described in depth. Bump bonding processes are vital for 3D-SiP packages, and the bonding technology of copper bumps is a research hotspot in the field of advanced packaging. The surface mount technology and sealing technology used in some electronic devices are also briefly introduced. This paper provides insights for researchers studying soldering and bonding in contemporary electronic device packaging. [ABSTRACT FROM AUTHOR]
Copyright of Materials (1996-1944) is the property of MDPI and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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Header DbId: egs
DbLabel: Engineering Source
An: 185131570
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Soldering and Bonding in Contemporary Electronic Device Packaging.
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  Data: <searchLink fieldCode="AR" term="%22Li%2C+Yuxuan%22">Li, Yuxuan</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> panbei1981@126.com</i><br /><searchLink fieldCode="AR" term="%22Pan%2C+Bei%22">Pan, Bei</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Ge%2C+Zhenting%22">Ge, Zhenting</searchLink><relatesTo>1,3</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Chen%2C+Pengpeng%22">Chen, Pengpeng</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Bi%2C+Bo%22">Bi, Bo</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Yi%2C+Xin%22">Yi, Xin</searchLink><relatesTo>1,3</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Wu%2C+Chaochao%22">Wu, Chaochao</searchLink><relatesTo>2</relatesTo> (AUTHOR)<i> yu_xuan_li@yeah.net</i><br /><searchLink fieldCode="AR" term="%22Wang%2C+Ce%22">Wang, Ce</searchLink><relatesTo>3</relatesTo> (AUTHOR)
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  Data: <searchLink fieldCode="JN" term="%22Materials+%281996-1944%29%22">Materials (1996-1944)</searchLink>. May2025, Vol. 18 Issue 9, p2015. 19p.
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  Data: <searchLink fieldCode="DE" term="%22Surface+mount+technology%22">Surface mount technology</searchLink><br /><searchLink fieldCode="DE" term="%22Electronic+packaging%22">Electronic packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Sealing+%28Technology%29%22">Sealing (Technology)</searchLink><br /><searchLink fieldCode="DE" term="%22Electronic+equipment%22">Electronic equipment</searchLink><br /><searchLink fieldCode="DE" term="%22Copper%22">Copper</searchLink><br /><searchLink fieldCode="DE" term="%22Semiconductor+wafer+bonding%22">Semiconductor wafer bonding</searchLink><br /><searchLink fieldCode="DE" term="%22Flip+chip+technology%22">Flip chip technology</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: Electronic packaging can transform the chip to a device for assembly. Soldering and bonding are important procedures in the process of electronic packaging. The continuous development of packaging architecture has driven the emergence of improved soldering and bonding processes. At the same time, conventional soldering and bonding processes are still widely used in device packaging. This paper introduces two kinds of technologies in wafer bonding, direct and indirect, expounds on five kinds of die attachment processes, and also describes the process of ball bonding and wedge bonding in wire bonding in detail. Flip chip bonding and methods for making bumps are also described in depth. Bump bonding processes are vital for 3D-SiP packages, and the bonding technology of copper bumps is a research hotspot in the field of advanced packaging. The surface mount technology and sealing technology used in some electronic devices are also briefly introduced. This paper provides insights for researchers studying soldering and bonding in contemporary electronic device packaging. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Materials (1996-1944) is the property of MDPI and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
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        Value: 10.3390/ma18092015
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      – Code: eng
        Text: English
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        PageCount: 19
        StartPage: 2015
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      – SubjectFull: Surface mount technology
        Type: general
      – SubjectFull: Electronic packaging
        Type: general
      – SubjectFull: Sealing (Technology)
        Type: general
      – SubjectFull: Electronic equipment
        Type: general
      – SubjectFull: Copper
        Type: general
      – SubjectFull: Semiconductor wafer bonding
        Type: general
      – SubjectFull: Flip chip technology
        Type: general
    Titles:
      – TitleFull: Soldering and Bonding in Contemporary Electronic Device Packaging.
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            NameFull: Li, Yuxuan
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            NameFull: Pan, Bei
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            NameFull: Chen, Pengpeng
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            NameFull: Bi, Bo
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            – D: 01
              M: 05
              Text: May2025
              Type: published
              Y: 2025
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              Value: 18
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