The 25th European Microelectronics & Packaging Conference (EMPC 2025): 16 - 18 September 2025: World Trade Center, Grenoble | France.

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Bibliographic Details
Title: The 25th European Microelectronics & Packaging Conference (EMPC 2025): 16 - 18 September 2025: World Trade Center, Grenoble | France.
Source: Advancing Microelectronics. 2025, Vol. 52 Issue 2, p23-37. 15p.
Subjects: Career development, Wafer level packaging, Thermal interface materials, Event management, Electronic packaging, Flip chip technology, Corporate websites, Server farms (Computer network management)
Database: Engineering Source
Description
ISSN:23807008