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The 25th European Microelectronics & Packaging Conference (EMPC 2025): 16 - 18 September 2025: World Trade Center, Grenoble | France.

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Title: The 25th European Microelectronics & Packaging Conference (EMPC 2025): 16 - 18 September 2025: World Trade Center, Grenoble | France.
Source: Advancing Microelectronics. 2025, Vol. 52 Issue 2, p23-37. 15p.
Subjects: Career development, Wafer level packaging, Thermal interface materials, Event management, Electronic packaging, Flip chip technology, Corporate websites, Server farms (Computer network management)
Database: Engineering Source
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Header DbId: egs
DbLabel: Engineering Source
An: 185643016
AccessLevel: 6
PubType: Periodical
PubTypeId: serialPeriodical
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  Data: The 25th European Microelectronics & Packaging Conference (EMPC 2025): 16 - 18 September 2025: World Trade Center, Grenoble | France.
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  Data: <searchLink fieldCode="JN" term="%22Advancing+Microelectronics%22">Advancing Microelectronics</searchLink>. 2025, Vol. 52 Issue 2, p23-37. 15p.
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  Data: <searchLink fieldCode="DE" term="%22Career+development%22">Career development</searchLink><br /><searchLink fieldCode="DE" term="%22Wafer+level+packaging%22">Wafer level packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Thermal+interface+materials%22">Thermal interface materials</searchLink><br /><searchLink fieldCode="DE" term="%22Event+management%22">Event management</searchLink><br /><searchLink fieldCode="DE" term="%22Electronic+packaging%22">Electronic packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Flip+chip+technology%22">Flip chip technology</searchLink><br /><searchLink fieldCode="DE" term="%22Corporate+websites%22">Corporate websites</searchLink><br /><searchLink fieldCode="DE" term="%22Server+farms+%28Computer+network+management%29%22">Server farms (Computer network management)</searchLink>
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RecordInfo BibRecord:
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      – Code: eng
        Text: English
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        PageCount: 15
        StartPage: 23
    Subjects:
      – SubjectFull: Career development
        Type: general
      – SubjectFull: Wafer level packaging
        Type: general
      – SubjectFull: Thermal interface materials
        Type: general
      – SubjectFull: Event management
        Type: general
      – SubjectFull: Electronic packaging
        Type: general
      – SubjectFull: Flip chip technology
        Type: general
      – SubjectFull: Corporate websites
        Type: general
      – SubjectFull: Server farms (Computer network management)
        Type: general
    Titles:
      – TitleFull: The 25th European Microelectronics & Packaging Conference (EMPC 2025): 16 - 18 September 2025: World Trade Center, Grenoble | France.
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            – D: 01
              M: 03
              Text: 2025
              Type: published
              Y: 2025
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              Value: 52
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            – TitleFull: Advancing Microelectronics
              Type: main
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