Bibliographic Details
| Title: |
Process Optimization of Additively Manufactured Conformal Temperature and Humidity Sensor for High-Temperature Applications. |
| Authors: |
Lamport, Emily1, Avuthu, Sai G. R.2, Si Chen2, Mapkar, Javed2, Akyurtlu, Alkim1 |
| Source: |
Journal of Microelectronic & Electronic Packaging. 2025, Vol. 22 Issue 1, p13-20. 8p. |
| Subjects: |
Reliability of electronics, Waste minimization, Temperature sensors, Printed electronics, Printed circuits |
| Abstract: |
Additive Manufacturing (AM) and Printed Electronics (PE) have recently seen widespread implementation in numerous technological applications. The shift towards manufacturing AM PE is largely due to the numerous benefits that AM offers compared to traditional manufacturing. Some of these benefits include the ability to rapidly prototype and the reduction of waste material compared to traditional manufacturing methods, and the ability to realize conformal circuits onto existing structures and substrates with varying form factors. In this work, an AM analog temperature and humidity sensor for high temperature applications was designed and printed using a multi-axis tabletop nScrypt printer. Electrical, mechanical, and statistical testing was performed on the circuits to assess the performance and uniformity of the printed circuits. [ABSTRACT FROM AUTHOR] |
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| Database: |
Engineering Source |