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Process Optimization of Additively Manufactured Conformal Temperature and Humidity Sensor for High-Temperature Applications.

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Title: Process Optimization of Additively Manufactured Conformal Temperature and Humidity Sensor for High-Temperature Applications.
Authors: Lamport, Emily1, Avuthu, Sai G. R.2, Si Chen2, Mapkar, Javed2, Akyurtlu, Alkim1
Source: Journal of Microelectronic & Electronic Packaging. 2025, Vol. 22 Issue 1, p13-20. 8p.
Subjects: Reliability of electronics, Waste minimization, Temperature sensors, Printed electronics, Printed circuits
Abstract: Additive Manufacturing (AM) and Printed Electronics (PE) have recently seen widespread implementation in numerous technological applications. The shift towards manufacturing AM PE is largely due to the numerous benefits that AM offers compared to traditional manufacturing. Some of these benefits include the ability to rapidly prototype and the reduction of waste material compared to traditional manufacturing methods, and the ability to realize conformal circuits onto existing structures and substrates with varying form factors. In this work, an AM analog temperature and humidity sensor for high temperature applications was designed and printed using a multi-axis tabletop nScrypt printer. Electrical, mechanical, and statistical testing was performed on the circuits to assess the performance and uniformity of the printed circuits. [ABSTRACT FROM AUTHOR]
Copyright of Journal of Microelectronic & Electronic Packaging is the property of International Microelectronics & Packaging Society and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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  Data: Process Optimization of Additively Manufactured Conformal Temperature and Humidity Sensor for High-Temperature Applications.
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Microelectronic+%26+Electronic+Packaging%22">Journal of Microelectronic & Electronic Packaging</searchLink>. 2025, Vol. 22 Issue 1, p13-20. 8p.
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  Data: <searchLink fieldCode="DE" term="%22Reliability+of+electronics%22">Reliability of electronics</searchLink><br /><searchLink fieldCode="DE" term="%22Waste+minimization%22">Waste minimization</searchLink><br /><searchLink fieldCode="DE" term="%22Temperature+sensors%22">Temperature sensors</searchLink><br /><searchLink fieldCode="DE" term="%22Printed+electronics%22">Printed electronics</searchLink><br /><searchLink fieldCode="DE" term="%22Printed+circuits%22">Printed circuits</searchLink>
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  Label: Abstract
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  Data: Additive Manufacturing (AM) and Printed Electronics (PE) have recently seen widespread implementation in numerous technological applications. The shift towards manufacturing AM PE is largely due to the numerous benefits that AM offers compared to traditional manufacturing. Some of these benefits include the ability to rapidly prototype and the reduction of waste material compared to traditional manufacturing methods, and the ability to realize conformal circuits onto existing structures and substrates with varying form factors. In this work, an AM analog temperature and humidity sensor for high temperature applications was designed and printed using a multi-axis tabletop nScrypt printer. Electrical, mechanical, and statistical testing was performed on the circuits to assess the performance and uniformity of the printed circuits. [ABSTRACT FROM AUTHOR]
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  Label:
  Group: Ab
  Data: <i>Copyright of Journal of Microelectronic & Electronic Packaging is the property of International Microelectronics & Packaging Society and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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        Value: 10.4071/001c.133286
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      – Code: eng
        Text: English
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        PageCount: 8
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      – SubjectFull: Reliability of electronics
        Type: general
      – SubjectFull: Waste minimization
        Type: general
      – SubjectFull: Temperature sensors
        Type: general
      – SubjectFull: Printed electronics
        Type: general
      – SubjectFull: Printed circuits
        Type: general
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            NameFull: Si Chen
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            NameFull: Mapkar, Javed
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            – D: 01
              M: 01
              Text: 2025
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              Y: 2025
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