A Review of Novel Die Attach Materials for High-Temperature WBG Power Electronic Applications.
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| Title: | A Review of Novel Die Attach Materials for High-Temperature WBG Power Electronic Applications. |
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| Authors: | Wu, Na1 (AUTHOR) wuna.ws@163.com, Li, Yuxiang1 (AUTHOR) |
| Source: | Materials (1996-1944). Aug2025, Vol. 18 Issue 16, p3841. 27p. |
| Subjects: | High temperatures, High temperature electronics, Joining processes, Nanoparticles, Thermal interface materials, Adhesives |
| Abstract: | Third-generation wide-bandgap (WBG) semiconductor power electronics exhibit excellent workability, but high-temperature packaging technology limits their applications. TLP, TLPS, and nanoparticle sintering have the potential to achieve a high-temperature-resistant joint at a lower bonding temperature. However, a long bonding time, voids in the joint, powder oxidation, and organic solvent residues impede their application. A novel interlayer and other approaches have been proposed, such as preformed Sn-coated Cu foam (CF@Sn), a Cu-Sn nanocomposite interlayer, self-reducible Cu nanoparticle paste, bimodal-sized Cu nanoparticle pastes, organic-free nanoparticle films, and high-thermal-conductivity and low-CTE composite paste. Their preparation, bonding processes, and joint properties are compared in this paper. [ABSTRACT FROM AUTHOR] |
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| Database: | Engineering Source |
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| Abstract: | Third-generation wide-bandgap (WBG) semiconductor power electronics exhibit excellent workability, but high-temperature packaging technology limits their applications. TLP, TLPS, and nanoparticle sintering have the potential to achieve a high-temperature-resistant joint at a lower bonding temperature. However, a long bonding time, voids in the joint, powder oxidation, and organic solvent residues impede their application. A novel interlayer and other approaches have been proposed, such as preformed Sn-coated Cu foam (CF@Sn), a Cu-Sn nanocomposite interlayer, self-reducible Cu nanoparticle paste, bimodal-sized Cu nanoparticle pastes, organic-free nanoparticle films, and high-thermal-conductivity and low-CTE composite paste. Their preparation, bonding processes, and joint properties are compared in this paper. [ABSTRACT FROM AUTHOR] |
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| ISSN: | 19961944 |
| DOI: | 10.3390/ma18163841 |
