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A Review of Novel Die Attach Materials for High-Temperature WBG Power Electronic Applications.

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Title: A Review of Novel Die Attach Materials for High-Temperature WBG Power Electronic Applications.
Authors: Wu, Na1 (AUTHOR) wuna.ws@163.com, Li, Yuxiang1 (AUTHOR)
Source: Materials (1996-1944). Aug2025, Vol. 18 Issue 16, p3841. 27p.
Subjects: High temperatures, High temperature electronics, Joining processes, Nanoparticles, Thermal interface materials, Adhesives
Abstract: Third-generation wide-bandgap (WBG) semiconductor power electronics exhibit excellent workability, but high-temperature packaging technology limits their applications. TLP, TLPS, and nanoparticle sintering have the potential to achieve a high-temperature-resistant joint at a lower bonding temperature. However, a long bonding time, voids in the joint, powder oxidation, and organic solvent residues impede their application. A novel interlayer and other approaches have been proposed, such as preformed Sn-coated Cu foam (CF@Sn), a Cu-Sn nanocomposite interlayer, self-reducible Cu nanoparticle paste, bimodal-sized Cu nanoparticle pastes, organic-free nanoparticle films, and high-thermal-conductivity and low-CTE composite paste. Their preparation, bonding processes, and joint properties are compared in this paper. [ABSTRACT FROM AUTHOR]
Copyright of Materials (1996-1944) is the property of MDPI and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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DbLabel: Engineering Source
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PubType: Academic Journal
PubTypeId: academicJournal
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  Label: Title
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  Data: A Review of Novel Die Attach Materials for High-Temperature WBG Power Electronic Applications.
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  Data: <searchLink fieldCode="AR" term="%22Wu%2C+Na%22">Wu, Na</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> wuna.ws@163.com</i><br /><searchLink fieldCode="AR" term="%22Li%2C+Yuxiang%22">Li, Yuxiang</searchLink><relatesTo>1</relatesTo> (AUTHOR)
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  Data: <searchLink fieldCode="JN" term="%22Materials+%281996-1944%29%22">Materials (1996-1944)</searchLink>. Aug2025, Vol. 18 Issue 16, p3841. 27p.
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  Data: <searchLink fieldCode="DE" term="%22High+temperatures%22">High temperatures</searchLink><br /><searchLink fieldCode="DE" term="%22High+temperature+electronics%22">High temperature electronics</searchLink><br /><searchLink fieldCode="DE" term="%22Joining+processes%22">Joining processes</searchLink><br /><searchLink fieldCode="DE" term="%22Nanoparticles%22">Nanoparticles</searchLink><br /><searchLink fieldCode="DE" term="%22Thermal+interface+materials%22">Thermal interface materials</searchLink><br /><searchLink fieldCode="DE" term="%22Adhesives%22">Adhesives</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: Third-generation wide-bandgap (WBG) semiconductor power electronics exhibit excellent workability, but high-temperature packaging technology limits their applications. TLP, TLPS, and nanoparticle sintering have the potential to achieve a high-temperature-resistant joint at a lower bonding temperature. However, a long bonding time, voids in the joint, powder oxidation, and organic solvent residues impede their application. A novel interlayer and other approaches have been proposed, such as preformed Sn-coated Cu foam (CF@Sn), a Cu-Sn nanocomposite interlayer, self-reducible Cu nanoparticle paste, bimodal-sized Cu nanoparticle pastes, organic-free nanoparticle films, and high-thermal-conductivity and low-CTE composite paste. Their preparation, bonding processes, and joint properties are compared in this paper. [ABSTRACT FROM AUTHOR]
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  Group: Ab
  Data: <i>Copyright of Materials (1996-1944) is the property of MDPI and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.3390/ma18163841
    Languages:
      – Code: eng
        Text: English
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      Pagination:
        PageCount: 27
        StartPage: 3841
    Subjects:
      – SubjectFull: High temperatures
        Type: general
      – SubjectFull: High temperature electronics
        Type: general
      – SubjectFull: Joining processes
        Type: general
      – SubjectFull: Nanoparticles
        Type: general
      – SubjectFull: Thermal interface materials
        Type: general
      – SubjectFull: Adhesives
        Type: general
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      – TitleFull: A Review of Novel Die Attach Materials for High-Temperature WBG Power Electronic Applications.
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            NameFull: Wu, Na
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            NameFull: Li, Yuxiang
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              Text: Aug2025
              Type: published
              Y: 2025
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              Value: 18
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              Value: 16
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            – TitleFull: Materials (1996-1944)
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