Performance Assessment and Improvement of Two‐Phase Immersion Cooling for Multi‐Chip Module.
Saved in:
| Title: | Performance Assessment and Improvement of Two‐Phase Immersion Cooling for Multi‐Chip Module. |
|---|---|
| Authors: | Zhou, Liqun1 (AUTHOR) zhoulq@lut.edu.cn, Li, Qian1 (AUTHOR), Lin, Shi2 (AUTHOR), Zhao, Bowen1 (AUTHOR) |
| Source: | Asia-Pacific Journal of Chemical Engineering. Jul/Aug2025, Vol. 20 Issue 4, p1-15. 15p. |
| Subjects: | Multichip modules (Microelectronics), Computational fluid dynamics, Heat transfer fluids, Thermal equilibrium, Fluid velocity measurements, Temperature control, Phase transitions |
| Abstract: | Thermal management of chips is a key bottleneck to power densification. Two‐phase immersion methods provide a potential alternative to realize the goal of thermal management on chips. In this paper, a numerical model of a multi‐chip module is established to evaluate the thermal performance of two‐phase immersion cooling based on the CFD method. The effects of coolant type, inlet velocity, and subcooling are investigated. The results indicate that the coolant type, inlet velocity, and subcooling significantly affect the temperature of the multi‐chip module. Compared with FC‐72, the chip temperature dropped considerably by using Novec7100, which has higher latent heat. When the inlet subcooling remains constant, the chip temperature gradually decreases as the coolant flow rate increases. The chip temperature remains virtually stable when the inlet velocity exceeds 0.8 m/s. For this model, the optimal subcooling should be around 30°C. The baffle can effectively improve the overall temperature uniformity of the multi‐chip module. The addition of the baffle can reduce the temperature uniformity coefficient of the chip by up to 63.08%. After further optimization, the temperature uniformity is increased by 35.89%. [ABSTRACT FROM AUTHOR] |
| Copyright of Asia-Pacific Journal of Chemical Engineering is the property of Wiley-Blackwell and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
|
Full text is not displayed to guests.
Login for full access.
|
|
| Abstract: | Thermal management of chips is a key bottleneck to power densification. Two‐phase immersion methods provide a potential alternative to realize the goal of thermal management on chips. In this paper, a numerical model of a multi‐chip module is established to evaluate the thermal performance of two‐phase immersion cooling based on the CFD method. The effects of coolant type, inlet velocity, and subcooling are investigated. The results indicate that the coolant type, inlet velocity, and subcooling significantly affect the temperature of the multi‐chip module. Compared with FC‐72, the chip temperature dropped considerably by using Novec7100, which has higher latent heat. When the inlet subcooling remains constant, the chip temperature gradually decreases as the coolant flow rate increases. The chip temperature remains virtually stable when the inlet velocity exceeds 0.8 m/s. For this model, the optimal subcooling should be around 30°C. The baffle can effectively improve the overall temperature uniformity of the multi‐chip module. The addition of the baffle can reduce the temperature uniformity coefficient of the chip by up to 63.08%. After further optimization, the temperature uniformity is increased by 35.89%. [ABSTRACT FROM AUTHOR] |
|---|---|
| ISSN: | 19322135 |
| DOI: | 10.1002/apj.70039 |
