Performance Assessment and Improvement of Two‐Phase Immersion Cooling for Multi‐Chip Module.
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| Title: | Performance Assessment and Improvement of Two‐Phase Immersion Cooling for Multi‐Chip Module. |
|---|---|
| Authors: | Zhou, Liqun1 (AUTHOR) zhoulq@lut.edu.cn, Li, Qian1 (AUTHOR), Lin, Shi2 (AUTHOR), Zhao, Bowen1 (AUTHOR) |
| Source: | Asia-Pacific Journal of Chemical Engineering. Jul/Aug2025, Vol. 20 Issue 4, p1-15. 15p. |
| Subjects: | Multichip modules (Microelectronics), Computational fluid dynamics, Heat transfer fluids, Thermal equilibrium, Fluid velocity measurements, Temperature control, Phase transitions |
| Abstract: | Thermal management of chips is a key bottleneck to power densification. Two‐phase immersion methods provide a potential alternative to realize the goal of thermal management on chips. In this paper, a numerical model of a multi‐chip module is established to evaluate the thermal performance of two‐phase immersion cooling based on the CFD method. The effects of coolant type, inlet velocity, and subcooling are investigated. The results indicate that the coolant type, inlet velocity, and subcooling significantly affect the temperature of the multi‐chip module. Compared with FC‐72, the chip temperature dropped considerably by using Novec7100, which has higher latent heat. When the inlet subcooling remains constant, the chip temperature gradually decreases as the coolant flow rate increases. The chip temperature remains virtually stable when the inlet velocity exceeds 0.8 m/s. For this model, the optimal subcooling should be around 30°C. The baffle can effectively improve the overall temperature uniformity of the multi‐chip module. The addition of the baffle can reduce the temperature uniformity coefficient of the chip by up to 63.08%. After further optimization, the temperature uniformity is increased by 35.89%. [ABSTRACT FROM AUTHOR] |
| Copyright of Asia-Pacific Journal of Chemical Engineering is the property of Wiley-Blackwell and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
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| Header | DbId: egs DbLabel: Engineering Source An: 189333049 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Performance Assessment and Improvement of Two‐Phase Immersion Cooling for Multi‐Chip Module. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Zhou%2C+Liqun%22">Zhou, Liqun</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> zhoulq@lut.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Li%2C+Qian%22">Li, Qian</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Lin%2C+Shi%22">Lin, Shi</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Zhao%2C+Bowen%22">Zhao, Bowen</searchLink><relatesTo>1</relatesTo> (AUTHOR) – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Asia-Pacific+Journal+of+Chemical+Engineering%22">Asia-Pacific Journal of Chemical Engineering</searchLink>. Jul/Aug2025, Vol. 20 Issue 4, p1-15. 15p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Multichip+modules+%28Microelectronics%29%22">Multichip modules (Microelectronics)</searchLink><br /><searchLink fieldCode="DE" term="%22Computational+fluid+dynamics%22">Computational fluid dynamics</searchLink><br /><searchLink fieldCode="DE" term="%22Heat+transfer+fluids%22">Heat transfer fluids</searchLink><br /><searchLink fieldCode="DE" term="%22Thermal+equilibrium%22">Thermal equilibrium</searchLink><br /><searchLink fieldCode="DE" term="%22Fluid+velocity+measurements%22">Fluid velocity measurements</searchLink><br /><searchLink fieldCode="DE" term="%22Temperature+control%22">Temperature control</searchLink><br /><searchLink fieldCode="DE" term="%22Phase+transitions%22">Phase transitions</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: Thermal management of chips is a key bottleneck to power densification. Two‐phase immersion methods provide a potential alternative to realize the goal of thermal management on chips. In this paper, a numerical model of a multi‐chip module is established to evaluate the thermal performance of two‐phase immersion cooling based on the CFD method. The effects of coolant type, inlet velocity, and subcooling are investigated. The results indicate that the coolant type, inlet velocity, and subcooling significantly affect the temperature of the multi‐chip module. Compared with FC‐72, the chip temperature dropped considerably by using Novec7100, which has higher latent heat. When the inlet subcooling remains constant, the chip temperature gradually decreases as the coolant flow rate increases. The chip temperature remains virtually stable when the inlet velocity exceeds 0.8 m/s. For this model, the optimal subcooling should be around 30°C. The baffle can effectively improve the overall temperature uniformity of the multi‐chip module. The addition of the baffle can reduce the temperature uniformity coefficient of the chip by up to 63.08%. After further optimization, the temperature uniformity is increased by 35.89%. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Asia-Pacific Journal of Chemical Engineering is the property of Wiley-Blackwell and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1002/apj.70039 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 15 StartPage: 1 Subjects: – SubjectFull: Multichip modules (Microelectronics) Type: general – SubjectFull: Computational fluid dynamics Type: general – SubjectFull: Heat transfer fluids Type: general – SubjectFull: Thermal equilibrium Type: general – SubjectFull: Fluid velocity measurements Type: general – SubjectFull: Temperature control Type: general – SubjectFull: Phase transitions Type: general Titles: – TitleFull: Performance Assessment and Improvement of Two‐Phase Immersion Cooling for Multi‐Chip Module. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Zhou, Liqun – PersonEntity: Name: NameFull: Li, Qian – PersonEntity: Name: NameFull: Lin, Shi – PersonEntity: Name: NameFull: Zhao, Bowen IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 07 Text: Jul/Aug2025 Type: published Y: 2025 Identifiers: – Type: issn-print Value: 19322135 Numbering: – Type: volume Value: 20 – Type: issue Value: 4 Titles: – TitleFull: Asia-Pacific Journal of Chemical Engineering Type: main |
| ResultId | 1 |
