APA (7th ed.) Citation

Tzeng, Y., Lin, F., Guu, S. Y., Chien, Y., Jhang, A., Tsai, J., . . . Hsieh, W. (2025). MPCVD diamond thin films as heat spreaders for back end of the line (BEOL) silicon chip fabrication. Diamond & Related Materials, 160, N.PAG. https://doi.org/10.1016/j.diamond.2025.112999

Chicago Style (17th ed.) Citation

Tzeng, Yonhua, et al. "MPCVD Diamond Thin Films as Heat Spreaders for Back End of the Line (BEOL) Silicon Chip Fabrication." Diamond & Related Materials 160 (2025): N.PAG. https://doi.org/10.1016/j.diamond.2025.112999.

MLA (9th ed.) Citation

Tzeng, Yonhua, et al. "MPCVD Diamond Thin Films as Heat Spreaders for Back End of the Line (BEOL) Silicon Chip Fabrication." Diamond & Related Materials, vol. 160, 2025, p. N.PAG, https://doi.org/10.1016/j.diamond.2025.112999.