Laser-Induced Forward Transfer of Pre-Patterned Solder Paste for High-Aspect-Ratio Deposits.
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| Title: | Laser-Induced Forward Transfer of Pre-Patterned Solder Paste for High-Aspect-Ratio Deposits. |
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| Authors: | Liang, Chaofan1,2 (AUTHOR), Tian, Chongxin1,2,3 (AUTHOR) zhangyanmei201@mails.ucas.ac.cn, Zhang, Yanmei1,2 (AUTHOR), He, Xiuli1,2,3 (AUTHOR), Bian, Yanhua1,2,3 (AUTHOR), Dong, Binxin1,2 (AUTHOR), Yu, Gang1,2,3 (AUTHOR), Li, Shaoxia1,2 (AUTHOR) lisx@imech.ac.cn |
| Source: | Materials (1996-1944). Nov2025, Vol. 18 Issue 22, p5154. 21p. |
| Subjects: | Solder pastes, Electronic packaging, Stencil printing, Laser deposition, Viscoelasticity |
| Abstract: | Precision solder deposition for 3D or flexible substrates remains a persistent challenge in electronic packaging. This study introduces a hybrid process that integrates stencil printing with laser-induced forward transfer (LIFT), employing a customized line-scan trajectory to fabricate high-aspect-ratio solder deposits under large-gap, contactless conditions. Solder paste patterns were first printed on a glass carrier and subsequently transferred using pulsed laser scanning, with high-speed imaging employed to resolve the transfer dynamics. Three transfer regimes—stable, unstable, and no transfer—were identified, with the stable regime exhibiting sequential stages governed by vaporization-induced pressure and the viscoelastic response of the solder paste. The initial aspect ratio (AR) was found to critically influence separation behavior, with AR = 0.3 marking the transition between bridging and cantilevered morphologies. Transferred deposits consistently achieved final aspect ratios approaching 0.7; notably, low-AR (<0.15) patterns showed a 2.2-fold height increase. The process maintains a robust energy window (0.937–1.112 J/cm2), offering both mechanistic insight into transfer stability and practical guidance for optimizing solder paste deposition in advanced packaging applications. [ABSTRACT FROM AUTHOR] |
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| Database: | Engineering Source |
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| Abstract: | Precision solder deposition for 3D or flexible substrates remains a persistent challenge in electronic packaging. This study introduces a hybrid process that integrates stencil printing with laser-induced forward transfer (LIFT), employing a customized line-scan trajectory to fabricate high-aspect-ratio solder deposits under large-gap, contactless conditions. Solder paste patterns were first printed on a glass carrier and subsequently transferred using pulsed laser scanning, with high-speed imaging employed to resolve the transfer dynamics. Three transfer regimes—stable, unstable, and no transfer—were identified, with the stable regime exhibiting sequential stages governed by vaporization-induced pressure and the viscoelastic response of the solder paste. The initial aspect ratio (AR) was found to critically influence separation behavior, with AR = 0.3 marking the transition between bridging and cantilevered morphologies. Transferred deposits consistently achieved final aspect ratios approaching 0.7; notably, low-AR (<0.15) patterns showed a 2.2-fold height increase. The process maintains a robust energy window (0.937–1.112 J/cm2), offering both mechanistic insight into transfer stability and practical guidance for optimizing solder paste deposition in advanced packaging applications. [ABSTRACT FROM AUTHOR] |
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| ISSN: | 19961944 |
| DOI: | 10.3390/ma18225154 |
