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Laser-Induced Forward Transfer of Pre-Patterned Solder Paste for High-Aspect-Ratio Deposits.

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Title: Laser-Induced Forward Transfer of Pre-Patterned Solder Paste for High-Aspect-Ratio Deposits.
Authors: Liang, Chaofan1,2 (AUTHOR), Tian, Chongxin1,2,3 (AUTHOR) zhangyanmei201@mails.ucas.ac.cn, Zhang, Yanmei1,2 (AUTHOR), He, Xiuli1,2,3 (AUTHOR), Bian, Yanhua1,2,3 (AUTHOR), Dong, Binxin1,2 (AUTHOR), Yu, Gang1,2,3 (AUTHOR), Li, Shaoxia1,2 (AUTHOR) lisx@imech.ac.cn
Source: Materials (1996-1944). Nov2025, Vol. 18 Issue 22, p5154. 21p.
Subjects: Solder pastes, Electronic packaging, Stencil printing, Laser deposition, Viscoelasticity
Abstract: Precision solder deposition for 3D or flexible substrates remains a persistent challenge in electronic packaging. This study introduces a hybrid process that integrates stencil printing with laser-induced forward transfer (LIFT), employing a customized line-scan trajectory to fabricate high-aspect-ratio solder deposits under large-gap, contactless conditions. Solder paste patterns were first printed on a glass carrier and subsequently transferred using pulsed laser scanning, with high-speed imaging employed to resolve the transfer dynamics. Three transfer regimes—stable, unstable, and no transfer—were identified, with the stable regime exhibiting sequential stages governed by vaporization-induced pressure and the viscoelastic response of the solder paste. The initial aspect ratio (AR) was found to critically influence separation behavior, with AR = 0.3 marking the transition between bridging and cantilevered morphologies. Transferred deposits consistently achieved final aspect ratios approaching 0.7; notably, low-AR (<0.15) patterns showed a 2.2-fold height increase. The process maintains a robust energy window (0.937–1.112 J/cm2), offering both mechanistic insight into transfer stability and practical guidance for optimizing solder paste deposition in advanced packaging applications. [ABSTRACT FROM AUTHOR]
Copyright of Materials (1996-1944) is the property of MDPI and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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  Data: Laser-Induced Forward Transfer of Pre-Patterned Solder Paste for High-Aspect-Ratio Deposits.
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  Data: &lt;searchLink fieldCode=&quot;JN&quot; term=&quot;%22Materials+%281996-1944%29%22&quot;&gt;Materials (1996-1944)&lt;/searchLink&gt;. Nov2025, Vol. 18 Issue 22, p5154. 21p.
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  Data: &lt;searchLink fieldCode=&quot;DE&quot; term=&quot;%22Solder+pastes%22&quot;&gt;Solder pastes&lt;/searchLink&gt;&lt;br /&gt;&lt;searchLink fieldCode=&quot;DE&quot; term=&quot;%22Electronic+packaging%22&quot;&gt;Electronic packaging&lt;/searchLink&gt;&lt;br /&gt;&lt;searchLink fieldCode=&quot;DE&quot; term=&quot;%22Stencil+printing%22&quot;&gt;Stencil printing&lt;/searchLink&gt;&lt;br /&gt;&lt;searchLink fieldCode=&quot;DE&quot; term=&quot;%22Laser+deposition%22&quot;&gt;Laser deposition&lt;/searchLink&gt;&lt;br /&gt;&lt;searchLink fieldCode=&quot;DE&quot; term=&quot;%22Viscoelasticity%22&quot;&gt;Viscoelasticity&lt;/searchLink&gt;
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: Precision solder deposition for 3D or flexible substrates remains a persistent challenge in electronic packaging. This study introduces a hybrid process that integrates stencil printing with laser-induced forward transfer (LIFT), employing a customized line-scan trajectory to fabricate high-aspect-ratio solder deposits under large-gap, contactless conditions. Solder paste patterns were first printed on a glass carrier and subsequently transferred using pulsed laser scanning, with high-speed imaging employed to resolve the transfer dynamics. Three transfer regimes—stable, unstable, and no transfer—were identified, with the stable regime exhibiting sequential stages governed by vaporization-induced pressure and the viscoelastic response of the solder paste. The initial aspect ratio (AR) was found to critically influence separation behavior, with AR = 0.3 marking the transition between bridging and cantilevered morphologies. Transferred deposits consistently achieved final aspect ratios approaching 0.7; notably, low-AR (&lt;0.15) patterns showed a 2.2-fold height increase. The process maintains a robust energy window (0.937–1.112 J/cm2), offering both mechanistic insight into transfer stability and practical guidance for optimizing solder paste deposition in advanced packaging applications. [ABSTRACT FROM AUTHOR]
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  Data: &lt;i&gt;Copyright of Materials (1996-1944) is the property of MDPI and its content may not be copied or emailed to multiple sites without the copyright holder&#39;s express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.&lt;/i&gt; (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.3390/ma18225154
    Languages:
      – Code: eng
        Text: English
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        PageCount: 21
        StartPage: 5154
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      – SubjectFull: Solder pastes
        Type: general
      – SubjectFull: Electronic packaging
        Type: general
      – SubjectFull: Stencil printing
        Type: general
      – SubjectFull: Laser deposition
        Type: general
      – SubjectFull: Viscoelasticity
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      – TitleFull: Laser-Induced Forward Transfer of Pre-Patterned Solder Paste for High-Aspect-Ratio Deposits.
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            NameFull: Liang, Chaofan
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              Text: Nov2025
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              Y: 2025
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