APA (7th ed.) Citation

Han, J., Ye, P., Braye, S., ElSawy, A., Khanna, H., Lambert, V., . . . Najjar, E. (2025). Advanced Electrochemical Plating Processes of Nano-Twinned Copper for Hybrid Bonding. Advancing Microelectronics, 52(5), 10.

Chicago Style (17th ed.) Citation

Han, Jianwen, et al. "Advanced Electrochemical Plating Processes of Nano-Twinned Copper for Hybrid Bonding." Advancing Microelectronics 52, no. 5 (2025): 10.

MLA (9th ed.) Citation

Han, Jianwen, et al. "Advanced Electrochemical Plating Processes of Nano-Twinned Copper for Hybrid Bonding." Advancing Microelectronics, vol. 52, no. 5, 2025, p. 10.