APA (7th ed.) Citation

Choi, J., Jang, S., & Kim, S. E. (2026). Reactive Sputtering of SiCN Films: Process Optimization and Bonding Behavior for Cu Hybrid Bonding. Journal of Electronic Materials, 55(1), 1222. https://doi.org/10.1007/s11664-025-12552-9

Chicago Style (17th ed.) Citation

Choi, Junyoung, Suin Jang, and Sarah Eunkyung Kim. "Reactive Sputtering of SiCN Films: Process Optimization and Bonding Behavior for Cu Hybrid Bonding." Journal of Electronic Materials 55, no. 1 (2026): 1222. https://doi.org/10.1007/s11664-025-12552-9.

MLA (9th ed.) Citation

Choi, Junyoung, et al. "Reactive Sputtering of SiCN Films: Process Optimization and Bonding Behavior for Cu Hybrid Bonding." Journal of Electronic Materials, vol. 55, no. 1, 2026, p. 1222, https://doi.org/10.1007/s11664-025-12552-9.