Bibliographic Details
| Title: |
ISTFA 2025 SYSTEM IN PACKAGE (SIP) USER GROUP. |
| Authors: |
Tanukonda, Chandu hemachandar.tanukonda.devarajulu@intel.com, O’Sullivan, Jer jer.osullivan@analog.com, Qiu, Wen wen.qiu@amd.com |
| Source: |
Electronic Device Failure Analysis. Feb2026, Vol. 28 Issue 1, p34-34. 2/3p. |
| Subjects: |
Failure analysis, Multichip modules (Microelectronics), Conferences & conventions, Problem solving, Packaging design |
| Abstract: |
The article reports on the ISTFA 2025 System in Package (SIP) User Group session, where experts discussed the challenges and solutions in SIP failure analysis, particularly for advanced 2.5D/3D packaging. |
| Database: |
Engineering Source |
