APA (7th ed.) Citation

Tanukonda, C., O’Sullivan, J., & Qiu, W. (2026). ISTFA 2025 SYSTEM IN PACKAGE (SIP) USER GROUP. Electronic Device Failure Analysis, 28(1), 34.

Chicago Style (17th ed.) Citation

Tanukonda, Chandu, Jer O’Sullivan, and Wen Qiu. "ISTFA 2025 SYSTEM IN PACKAGE (SIP) USER GROUP." Electronic Device Failure Analysis 28, no. 1 (2026): 34.

MLA (9th ed.) Citation

Tanukonda, Chandu, et al. "ISTFA 2025 SYSTEM IN PACKAGE (SIP) USER GROUP." Electronic Device Failure Analysis, vol. 28, no. 1, 2026, p. 34.