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ISTFA 2025 SYSTEM IN PACKAGE (SIP) USER GROUP.

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Title: ISTFA 2025 SYSTEM IN PACKAGE (SIP) USER GROUP.
Authors: Tanukonda, Chandu hemachandar.tanukonda.devarajulu@intel.com, O’Sullivan, Jer jer.osullivan@analog.com, Qiu, Wen wen.qiu@amd.com
Source: Electronic Device Failure Analysis. Feb2026, Vol. 28 Issue 1, p34-34. 2/3p.
Subjects: Failure analysis, Multichip modules (Microelectronics), Conferences & conventions, Problem solving, Packaging design
Abstract: The article reports on the ISTFA 2025 System in Package (SIP) User Group session, where experts discussed the challenges and solutions in SIP failure analysis, particularly for advanced 2.5D/3D packaging.
Database: Engineering Source
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Header DbId: egs
DbLabel: Engineering Source
An: 191336863
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: ISTFA 2025 SYSTEM IN PACKAGE (SIP) USER GROUP.
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  Data: <searchLink fieldCode="AR" term="%22Tanukonda%2C+Chandu%22">Tanukonda, Chandu</searchLink><i> hemachandar.tanukonda.devarajulu@intel.com</i><br /><searchLink fieldCode="AR" term="%22O’Sullivan%2C+Jer%22">O’Sullivan, Jer</searchLink><i> jer.osullivan@analog.com</i><br /><searchLink fieldCode="AR" term="%22Qiu%2C+Wen%22">Qiu, Wen</searchLink><i> wen.qiu@amd.com</i>
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  Data: <searchLink fieldCode="JN" term="%22Electronic+Device+Failure+Analysis%22">Electronic Device Failure Analysis</searchLink>. Feb2026, Vol. 28 Issue 1, p34-34. 2/3p.
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  Data: <searchLink fieldCode="DE" term="%22Failure+analysis%22">Failure analysis</searchLink><br /><searchLink fieldCode="DE" term="%22Multichip+modules+%28Microelectronics%29%22">Multichip modules (Microelectronics)</searchLink><br /><searchLink fieldCode="DE" term="%22Conferences+%26+conventions%22">Conferences & conventions</searchLink><br /><searchLink fieldCode="DE" term="%22Problem+solving%22">Problem solving</searchLink><br /><searchLink fieldCode="DE" term="%22Packaging+design%22">Packaging design</searchLink>
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  Label: Abstract
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  Data: The article reports on the ISTFA 2025 System in Package (SIP) User Group session, where experts discussed the challenges and solutions in SIP failure analysis, particularly for advanced 2.5D/3D packaging.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=191336863
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        Text: English
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        StartPage: 34
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      – SubjectFull: Failure analysis
        Type: general
      – SubjectFull: Multichip modules (Microelectronics)
        Type: general
      – SubjectFull: Conferences & conventions
        Type: general
      – SubjectFull: Problem solving
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      – SubjectFull: Packaging design
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              Text: Feb2026
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              Y: 2026
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