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Epoxy molding compound encapsulation process in IC packaging: a review at wafer and component levels.

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Title: Epoxy molding compound encapsulation process in IC packaging: a review at wafer and component levels.
Authors: Othman, Ainnur Hanim1 (AUTHOR) ainnurhanim.othman@gmail.com, Aziz, Mohd Sharizal Abdul2 (AUTHOR) msharizal@usm.my, Ishak, Mohammad Hafifi Hafiz1 (AUTHOR) mhafifihafiz@usm.my, Nashrudin, Muhammad Naqib3 (AUTHOR) muhammad.naqib.nashrudin@intel.com, Azman, Muhammad Aqil2,3 (AUTHOR) muhammad.aqil.azman@intel.com
Source: International Journal of Advanced Manufacturing Technology. Feb2026, Vol. 142 Issue 7/8, p3281-3305. 25p.
Subjects: Wafer level packaging, Electronic packaging, Compression molding, Epoxy resins, Reliability in engineering, Hard materials
Abstract: Encapsulation is critical for ensuring the durability and reliability of integrated circuits (ICs) in modern electronics, with epoxy molding compounds (EMCs) being widely adopted due to their cost-effectiveness, adaptability, and robust mechanical properties. This review aims to provide a comprehensive analysis of EMC encapsulation processes in IC packaging by comparing wafer-level packaging (WLP) and component-level packaging (CLP) while addressing key challenges and exploring future research directions. The review assesses key encapsulation techniques, including transfer molding, compression molding, and underfill encapsulation, highlighting their advantages, challenges, and applicability across various packaging geometries. It also examines critical process parameters, optimization strategies, and reliability testing protocols to address defects like voids, warpage, and delamination. Emerging solutions, including bio-based resins and recyclable materials are explored to enhance sustainability. The study identifies significant challenges in EMC encapsulation, including material limitations, interfacial stress and environmental concerns. It also highlights the potential of advanced EMC formulations with improved thermal conductivity, three-dimensional (3D) integration, and Artificial Intelligence (AI) driven process control to address these issues. The review highlights the importance of interdisciplinary collaboration in advancing encapsulation technologies, ensuring reliability, miniaturization, and environmental responsibility in the semiconductor industry. This review provides a comprehensive and up-to-date analysis of EMC encapsulation processes, offering insights into both current challenges and future research potentials. The work emphasizes the need for innovative solutions to meet the evolving demands of the semiconductor industry, making it a valuable resource for researchers and industry professionals. [ABSTRACT FROM AUTHOR]
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Database: Engineering Source
Description
Abstract:Encapsulation is critical for ensuring the durability and reliability of integrated circuits (ICs) in modern electronics, with epoxy molding compounds (EMCs) being widely adopted due to their cost-effectiveness, adaptability, and robust mechanical properties. This review aims to provide a comprehensive analysis of EMC encapsulation processes in IC packaging by comparing wafer-level packaging (WLP) and component-level packaging (CLP) while addressing key challenges and exploring future research directions. The review assesses key encapsulation techniques, including transfer molding, compression molding, and underfill encapsulation, highlighting their advantages, challenges, and applicability across various packaging geometries. It also examines critical process parameters, optimization strategies, and reliability testing protocols to address defects like voids, warpage, and delamination. Emerging solutions, including bio-based resins and recyclable materials are explored to enhance sustainability. The study identifies significant challenges in EMC encapsulation, including material limitations, interfacial stress and environmental concerns. It also highlights the potential of advanced EMC formulations with improved thermal conductivity, three-dimensional (3D) integration, and Artificial Intelligence (AI) driven process control to address these issues. The review highlights the importance of interdisciplinary collaboration in advancing encapsulation technologies, ensuring reliability, miniaturization, and environmental responsibility in the semiconductor industry. This review provides a comprehensive and up-to-date analysis of EMC encapsulation processes, offering insights into both current challenges and future research potentials. The work emphasizes the need for innovative solutions to meet the evolving demands of the semiconductor industry, making it a valuable resource for researchers and industry professionals. [ABSTRACT FROM AUTHOR]
ISSN:02683768
DOI:10.1007/s00170-025-17196-x