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Epoxy molding compound encapsulation process in IC packaging: a review at wafer and component levels.

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Title: Epoxy molding compound encapsulation process in IC packaging: a review at wafer and component levels.
Authors: Othman, Ainnur Hanim1 (AUTHOR) ainnurhanim.othman@gmail.com, Aziz, Mohd Sharizal Abdul2 (AUTHOR) msharizal@usm.my, Ishak, Mohammad Hafifi Hafiz1 (AUTHOR) mhafifihafiz@usm.my, Nashrudin, Muhammad Naqib3 (AUTHOR) muhammad.naqib.nashrudin@intel.com, Azman, Muhammad Aqil2,3 (AUTHOR) muhammad.aqil.azman@intel.com
Source: International Journal of Advanced Manufacturing Technology. Feb2026, Vol. 142 Issue 7/8, p3281-3305. 25p.
Subjects: Wafer level packaging, Electronic packaging, Compression molding, Epoxy resins, Reliability in engineering, Hard materials
Abstract: Encapsulation is critical for ensuring the durability and reliability of integrated circuits (ICs) in modern electronics, with epoxy molding compounds (EMCs) being widely adopted due to their cost-effectiveness, adaptability, and robust mechanical properties. This review aims to provide a comprehensive analysis of EMC encapsulation processes in IC packaging by comparing wafer-level packaging (WLP) and component-level packaging (CLP) while addressing key challenges and exploring future research directions. The review assesses key encapsulation techniques, including transfer molding, compression molding, and underfill encapsulation, highlighting their advantages, challenges, and applicability across various packaging geometries. It also examines critical process parameters, optimization strategies, and reliability testing protocols to address defects like voids, warpage, and delamination. Emerging solutions, including bio-based resins and recyclable materials are explored to enhance sustainability. The study identifies significant challenges in EMC encapsulation, including material limitations, interfacial stress and environmental concerns. It also highlights the potential of advanced EMC formulations with improved thermal conductivity, three-dimensional (3D) integration, and Artificial Intelligence (AI) driven process control to address these issues. The review highlights the importance of interdisciplinary collaboration in advancing encapsulation technologies, ensuring reliability, miniaturization, and environmental responsibility in the semiconductor industry. This review provides a comprehensive and up-to-date analysis of EMC encapsulation processes, offering insights into both current challenges and future research potentials. The work emphasizes the need for innovative solutions to meet the evolving demands of the semiconductor industry, making it a valuable resource for researchers and industry professionals. [ABSTRACT FROM AUTHOR]
Copyright of International Journal of Advanced Manufacturing Technology is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
FullText Text:
  Availability: 0
Header DbId: egs
DbLabel: Engineering Source
An: 191451985
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Epoxy molding compound encapsulation process in IC packaging: a review at wafer and component levels.
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  Data: <searchLink fieldCode="AR" term="%22Othman%2C+Ainnur+Hanim%22">Othman, Ainnur Hanim</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> ainnurhanim.othman@gmail.com</i><br /><searchLink fieldCode="AR" term="%22Aziz%2C+Mohd+Sharizal+Abdul%22">Aziz, Mohd Sharizal Abdul</searchLink><relatesTo>2</relatesTo> (AUTHOR)<i> msharizal@usm.my</i><br /><searchLink fieldCode="AR" term="%22Ishak%2C+Mohammad+Hafifi+Hafiz%22">Ishak, Mohammad Hafifi Hafiz</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> mhafifihafiz@usm.my</i><br /><searchLink fieldCode="AR" term="%22Nashrudin%2C+Muhammad+Naqib%22">Nashrudin, Muhammad Naqib</searchLink><relatesTo>3</relatesTo> (AUTHOR)<i> muhammad.naqib.nashrudin@intel.com</i><br /><searchLink fieldCode="AR" term="%22Azman%2C+Muhammad+Aqil%22">Azman, Muhammad Aqil</searchLink><relatesTo>2,3</relatesTo> (AUTHOR)<i> muhammad.aqil.azman@intel.com</i>
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  Data: <searchLink fieldCode="JN" term="%22International+Journal+of+Advanced+Manufacturing+Technology%22">International Journal of Advanced Manufacturing Technology</searchLink>. Feb2026, Vol. 142 Issue 7/8, p3281-3305. 25p.
– Name: Subject
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  Data: <searchLink fieldCode="DE" term="%22Wafer+level+packaging%22">Wafer level packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Electronic+packaging%22">Electronic packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Compression+molding%22">Compression molding</searchLink><br /><searchLink fieldCode="DE" term="%22Epoxy+resins%22">Epoxy resins</searchLink><br /><searchLink fieldCode="DE" term="%22Reliability+in+engineering%22">Reliability in engineering</searchLink><br /><searchLink fieldCode="DE" term="%22Hard+materials%22">Hard materials</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: Encapsulation is critical for ensuring the durability and reliability of integrated circuits (ICs) in modern electronics, with epoxy molding compounds (EMCs) being widely adopted due to their cost-effectiveness, adaptability, and robust mechanical properties. This review aims to provide a comprehensive analysis of EMC encapsulation processes in IC packaging by comparing wafer-level packaging (WLP) and component-level packaging (CLP) while addressing key challenges and exploring future research directions. The review assesses key encapsulation techniques, including transfer molding, compression molding, and underfill encapsulation, highlighting their advantages, challenges, and applicability across various packaging geometries. It also examines critical process parameters, optimization strategies, and reliability testing protocols to address defects like voids, warpage, and delamination. Emerging solutions, including bio-based resins and recyclable materials are explored to enhance sustainability. The study identifies significant challenges in EMC encapsulation, including material limitations, interfacial stress and environmental concerns. It also highlights the potential of advanced EMC formulations with improved thermal conductivity, three-dimensional (3D) integration, and Artificial Intelligence (AI) driven process control to address these issues. The review highlights the importance of interdisciplinary collaboration in advancing encapsulation technologies, ensuring reliability, miniaturization, and environmental responsibility in the semiconductor industry. This review provides a comprehensive and up-to-date analysis of EMC encapsulation processes, offering insights into both current challenges and future research potentials. The work emphasizes the need for innovative solutions to meet the evolving demands of the semiconductor industry, making it a valuable resource for researchers and industry professionals. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of International Journal of Advanced Manufacturing Technology is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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        Value: 10.1007/s00170-025-17196-x
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        Text: English
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        PageCount: 25
        StartPage: 3281
    Subjects:
      – SubjectFull: Wafer level packaging
        Type: general
      – SubjectFull: Electronic packaging
        Type: general
      – SubjectFull: Compression molding
        Type: general
      – SubjectFull: Epoxy resins
        Type: general
      – SubjectFull: Reliability in engineering
        Type: general
      – SubjectFull: Hard materials
        Type: general
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      – TitleFull: Epoxy molding compound encapsulation process in IC packaging: a review at wafer and component levels.
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            NameFull: Othman, Ainnur Hanim
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              M: 02
              Text: Feb2026
              Type: published
              Y: 2026
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