DEVICE PACKAGING 2026.
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| Title: | DEVICE PACKAGING 2026. |
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| Source: | Advancing Microelectronics. 2026, Vol. 53 Issue 1, p28-48. 19p. |
| Subjects: | Wafer level packaging, Optical interconnects, Electronic packaging, Temperature control equipment |
| Abstract: | The document outlines the agenda and key details for DEVICE PACKAGING 2026, a professional conference focused on advanced semiconductor packaging technologies and industry trends. The event includes professional development courses covering topics such as onshoring manufacturing, photonic interconnects, substrates, fan-out wafer level packaging (FOWLP), and thermal management, led by industry experts from companies like Amkor Technology, Fraunhofer IZM, and NVIDIA. Keynote sessions address challenges and innovations in silicon photonics, power packaging for AI/data centers, and heterogeneous integration, featuring leaders from NVIDIA, Infineon, AMD, and AGC. The conference also offers student-industry networking, panel discussions on co-packaged optics, and extensive technical sessions on materials, interconnects, reliability, and emerging packaging architectures such as 2.5D/3D integration and chiplets. Exhibitors include major semiconductor and materials companies, and the event is held at the Sheraton Grand at Wild Horse Pass in Phoenix, Arizona. [Extracted from the article] |
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| Database: | Engineering Source |
| Abstract: | The document outlines the agenda and key details for DEVICE PACKAGING 2026, a professional conference focused on advanced semiconductor packaging technologies and industry trends. The event includes professional development courses covering topics such as onshoring manufacturing, photonic interconnects, substrates, fan-out wafer level packaging (FOWLP), and thermal management, led by industry experts from companies like Amkor Technology, Fraunhofer IZM, and NVIDIA. Keynote sessions address challenges and innovations in silicon photonics, power packaging for AI/data centers, and heterogeneous integration, featuring leaders from NVIDIA, Infineon, AMD, and AGC. The conference also offers student-industry networking, panel discussions on co-packaged optics, and extensive technical sessions on materials, interconnects, reliability, and emerging packaging architectures such as 2.5D/3D integration and chiplets. Exhibitors include major semiconductor and materials companies, and the event is held at the Sheraton Grand at Wild Horse Pass in Phoenix, Arizona. [Extracted from the article] |
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| ISSN: | 23807008 |
