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DEVICE PACKAGING 2026.

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Title: DEVICE PACKAGING 2026.
Source: Advancing Microelectronics. 2026, Vol. 53 Issue 1, p28-48. 19p.
Subjects: Wafer level packaging, Optical interconnects, Electronic packaging, Temperature control equipment
Abstract: The document outlines the agenda and key details for DEVICE PACKAGING 2026, a professional conference focused on advanced semiconductor packaging technologies and industry trends. The event includes professional development courses covering topics such as onshoring manufacturing, photonic interconnects, substrates, fan-out wafer level packaging (FOWLP), and thermal management, led by industry experts from companies like Amkor Technology, Fraunhofer IZM, and NVIDIA. Keynote sessions address challenges and innovations in silicon photonics, power packaging for AI/data centers, and heterogeneous integration, featuring leaders from NVIDIA, Infineon, AMD, and AGC. The conference also offers student-industry networking, panel discussions on co-packaged optics, and extensive technical sessions on materials, interconnects, reliability, and emerging packaging architectures such as 2.5D/3D integration and chiplets. Exhibitors include major semiconductor and materials companies, and the event is held at the Sheraton Grand at Wild Horse Pass in Phoenix, Arizona. [Extracted from the article]
Copyright of Advancing Microelectronics is the property of International Microelectronics & Packaging Society and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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  Data: <searchLink fieldCode="DE" term="%22Wafer+level+packaging%22">Wafer level packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Optical+interconnects%22">Optical interconnects</searchLink><br /><searchLink fieldCode="DE" term="%22Electronic+packaging%22">Electronic packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Temperature+control+equipment%22">Temperature control equipment</searchLink>
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  Data: The document outlines the agenda and key details for DEVICE PACKAGING 2026, a professional conference focused on advanced semiconductor packaging technologies and industry trends. The event includes professional development courses covering topics such as onshoring manufacturing, photonic interconnects, substrates, fan-out wafer level packaging (FOWLP), and thermal management, led by industry experts from companies like Amkor Technology, Fraunhofer IZM, and NVIDIA. Keynote sessions address challenges and innovations in silicon photonics, power packaging for AI/data centers, and heterogeneous integration, featuring leaders from NVIDIA, Infineon, AMD, and AGC. The conference also offers student-industry networking, panel discussions on co-packaged optics, and extensive technical sessions on materials, interconnects, reliability, and emerging packaging architectures such as 2.5D/3D integration and chiplets. Exhibitors include major semiconductor and materials companies, and the event is held at the Sheraton Grand at Wild Horse Pass in Phoenix, Arizona. [Extracted from the article]
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  Data: <i>Copyright of Advancing Microelectronics is the property of International Microelectronics & Packaging Society and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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      – SubjectFull: Wafer level packaging
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              Text: 2026
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