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Microstructure and Properties of Hot-Dip Tin-Lead on the Surface of 45 Steel.

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Bibliographic Details
Title: Microstructure and Properties of Hot-Dip Tin-Lead on the Surface of 45 Steel.
Authors: Wen, Fulin1 (AUTHOR) wfl_cqu@163.com, Liu, Jianhui1 (AUTHOR), Zheng, Dengzhi1 (AUTHOR)
Source: Journal of Materials Engineering & Performance. Mar2026, Vol. 35 Issue 10, p9523-9534. 12p.
Subjects: Alloy plating, Intermetallic compounds, Bond energy (Chemistry), Carbon steel, Surface coatings, Molecular dynamics
Abstract: Hot-dip tin-lead alloy plating experiments were carried out on the surface of 45 steel. The effects of hot-dip plating temperature and time on the morphology of the coating and the interface diffusion layer were investigated. The experimental results show that increasing the temperature and time is beneficial to obtaining a good coating surface. The interface compound formed between the coating and the substrate is FeSn2. With the increase in hot-dip plating time at 350 °C, the thickness of the coating and the diffusion layer generally shows an increasing trend, while the hardness of the coating shows a decreasing trend. In addition, molecular dynamics simulation was used to calculate the interface bonding energy of Sn-Pb/FeSn2/45 steel with different FeSn2 thicknesses at 350 °C. The simulation results indicate that with the increase in FeSn2 thickness, the interface bonding energy of (45 steel+FeSn2) is greater than that of (Sn-Pb+FeSn2). The interface bonding energies of both (Sn-Pb+FeSn2) and (45 steel+FeSn2) first increase and then decrease. [ABSTRACT FROM AUTHOR]
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Database: Engineering Source
Description
Abstract:Hot-dip tin-lead alloy plating experiments were carried out on the surface of 45 steel. The effects of hot-dip plating temperature and time on the morphology of the coating and the interface diffusion layer were investigated. The experimental results show that increasing the temperature and time is beneficial to obtaining a good coating surface. The interface compound formed between the coating and the substrate is FeSn2. With the increase in hot-dip plating time at 350 °C, the thickness of the coating and the diffusion layer generally shows an increasing trend, while the hardness of the coating shows a decreasing trend. In addition, molecular dynamics simulation was used to calculate the interface bonding energy of Sn-Pb/FeSn2/45 steel with different FeSn2 thicknesses at 350 °C. The simulation results indicate that with the increase in FeSn2 thickness, the interface bonding energy of (45 steel+FeSn2) is greater than that of (Sn-Pb+FeSn2). The interface bonding energies of both (Sn-Pb+FeSn2) and (45 steel+FeSn2) first increase and then decrease. [ABSTRACT FROM AUTHOR]
ISSN:10599495
DOI:10.1007/s11665-025-12352-6