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Microstructure and Properties of Hot-Dip Tin-Lead on the Surface of 45 Steel.

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Title: Microstructure and Properties of Hot-Dip Tin-Lead on the Surface of 45 Steel.
Authors: Wen, Fulin1 (AUTHOR) wfl_cqu@163.com, Liu, Jianhui1 (AUTHOR), Zheng, Dengzhi1 (AUTHOR)
Source: Journal of Materials Engineering & Performance. Mar2026, Vol. 35 Issue 10, p9523-9534. 12p.
Subjects: Alloy plating, Intermetallic compounds, Bond energy (Chemistry), Carbon steel, Surface coatings, Molecular dynamics
Abstract: Hot-dip tin-lead alloy plating experiments were carried out on the surface of 45 steel. The effects of hot-dip plating temperature and time on the morphology of the coating and the interface diffusion layer were investigated. The experimental results show that increasing the temperature and time is beneficial to obtaining a good coating surface. The interface compound formed between the coating and the substrate is FeSn2. With the increase in hot-dip plating time at 350 °C, the thickness of the coating and the diffusion layer generally shows an increasing trend, while the hardness of the coating shows a decreasing trend. In addition, molecular dynamics simulation was used to calculate the interface bonding energy of Sn-Pb/FeSn2/45 steel with different FeSn2 thicknesses at 350 °C. The simulation results indicate that with the increase in FeSn2 thickness, the interface bonding energy of (45 steel+FeSn2) is greater than that of (Sn-Pb+FeSn2). The interface bonding energies of both (Sn-Pb+FeSn2) and (45 steel+FeSn2) first increase and then decrease. [ABSTRACT FROM AUTHOR]
Copyright of Journal of Materials Engineering & Performance is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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DbLabel: Engineering Source
An: 192345178
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Microstructure and Properties of Hot-Dip Tin-Lead on the Surface of 45 Steel.
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  Data: <searchLink fieldCode="AR" term="%22Wen%2C+Fulin%22">Wen, Fulin</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> wfl_cqu@163.com</i><br /><searchLink fieldCode="AR" term="%22Liu%2C+Jianhui%22">Liu, Jianhui</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Zheng%2C+Dengzhi%22">Zheng, Dengzhi</searchLink><relatesTo>1</relatesTo> (AUTHOR)
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Engineering+%26+Performance%22">Journal of Materials Engineering & Performance</searchLink>. Mar2026, Vol. 35 Issue 10, p9523-9534. 12p.
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  Data: <searchLink fieldCode="DE" term="%22Alloy+plating%22">Alloy plating</searchLink><br /><searchLink fieldCode="DE" term="%22Intermetallic+compounds%22">Intermetallic compounds</searchLink><br /><searchLink fieldCode="DE" term="%22Bond+energy+%28Chemistry%29%22">Bond energy (Chemistry)</searchLink><br /><searchLink fieldCode="DE" term="%22Carbon+steel%22">Carbon steel</searchLink><br /><searchLink fieldCode="DE" term="%22Surface+coatings%22">Surface coatings</searchLink><br /><searchLink fieldCode="DE" term="%22Molecular+dynamics%22">Molecular dynamics</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: Hot-dip tin-lead alloy plating experiments were carried out on the surface of 45 steel. The effects of hot-dip plating temperature and time on the morphology of the coating and the interface diffusion layer were investigated. The experimental results show that increasing the temperature and time is beneficial to obtaining a good coating surface. The interface compound formed between the coating and the substrate is FeSn2. With the increase in hot-dip plating time at 350 °C, the thickness of the coating and the diffusion layer generally shows an increasing trend, while the hardness of the coating shows a decreasing trend. In addition, molecular dynamics simulation was used to calculate the interface bonding energy of Sn-Pb/FeSn2/45 steel with different FeSn2 thicknesses at 350 °C. The simulation results indicate that with the increase in FeSn2 thickness, the interface bonding energy of (45 steel+FeSn2) is greater than that of (Sn-Pb+FeSn2). The interface bonding energies of both (Sn-Pb+FeSn2) and (45 steel+FeSn2) first increase and then decrease. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Journal of Materials Engineering & Performance is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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      – Type: doi
        Value: 10.1007/s11665-025-12352-6
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      – Code: eng
        Text: English
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        PageCount: 12
        StartPage: 9523
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      – SubjectFull: Alloy plating
        Type: general
      – SubjectFull: Intermetallic compounds
        Type: general
      – SubjectFull: Bond energy (Chemistry)
        Type: general
      – SubjectFull: Carbon steel
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      – SubjectFull: Surface coatings
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      – SubjectFull: Molecular dynamics
        Type: general
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      – TitleFull: Microstructure and Properties of Hot-Dip Tin-Lead on the Surface of 45 Steel.
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            NameFull: Wen, Fulin
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            NameFull: Liu, Jianhui
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            NameFull: Zheng, Dengzhi
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            – D: 15
              M: 03
              Text: Mar2026
              Type: published
              Y: 2026
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