Bibliographic Details
| Title: |
Dynamic mechanical and spectroscopic studies of soy flour adhesives. |
| Authors: |
Parker, Anthony Allen1 tony@aaparkerconsulting.com, Marcinko, Joseph John2 |
| Source: |
Express Polymer Letters. Jun2026, Vol. 20 Issue 6, p594-616. 23p. |
| Subjects: |
Dynamic mechanical analysis, Adhesives, Crosslinked polymers, Nuclear magnetic resonance, Glass transition temperature, Fourier transform infrared spectroscopy, Material plasticity |
| Abstract: |
We used dynamic mechanical analysis (DMA) to evaluate soy flour adhesives made with and without a conventional crosslinking agent, polyamideamine-epichlorohydrin (PAE). Fixed-frequency and constant strain rate studies revealed that PAE contributes to a decrease in glass transition temperature (Tg), an increase in toughness, and a decrease in both the rubbery plateau modulus and onset temperature, consistent with plasticization. Fourier transform infrared spectroscopy (FTIR) and nuclear magnetic resonance (NMR) studies of water-soluble extracts from pre-cured soy flour revealed the presence of polypeptides with exchangeable protons, carbohydrates, citric acid and lactic acid. Deuterium exchange studies showed that the protonated peptides were no longer water-soluble after cure. Instead, post-cure extracts contained heat-modified carbohydrates and carboxylic acids, together with adipic acid when PAE was employed. These results are consistent with a mechanism whereby PAE not only undergoes hydrolysis and chain scission, but also competitively co-reacts with peptides and carboxylic acids to yield a plasticized chain-extended network with decreased crosslink density, counter to its anticipated function. The implications of these findings as they pertain to moisture resistance and wood adhesion will be discussed. [ABSTRACT FROM AUTHOR] |
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| Database: |
Engineering Source |