Interfaces and Transport Phenomena in Materials Under Extreme Conditions.
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| Title: | Interfaces and Transport Phenomena in Materials Under Extreme Conditions. |
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| Authors: | Chen, Yanxi1 (AUTHOR), Hu, Run2 (AUTHOR), Wang, Haidong1 (AUTHOR) |
| Source: | Materials (1996-1944). May2026, Vol. 19 Issue 9, p1910. 4p. |
| Subjects: | Interfaces (Physical sciences), Heat transfer, Materials science, Nanostructured materials, Transport theory |
| Abstract: | This article focuses on recent advances in understanding interfaces and transport phenomena in materials under extreme conditions, such as atomic scales, ultrafast processes, and ultra-high power densities. It highlights experimental, theoretical, and computational progress in nanoscale thermal transport, non-equilibrium ultrafast carrier dynamics, and thermal management in high-power devices. The Special Issue includes studies on enhanced optoelectronic nanofilms, silicon carbide thin-film growth on silicon substrates, improved epoxy nanocomposites, novel two-dimensional ferrovalley materials, and precise thermoelectric measurements of 2D nanomaterials. The article emphasizes the integration of materials innovation, interface engineering, multiscale simulation, and artificial intelligence as key pathways for future research and technological development in this field. [Extracted from the article] |
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| Database: | Engineering Source |
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| Abstract: | This article focuses on recent advances in understanding interfaces and transport phenomena in materials under extreme conditions, such as atomic scales, ultrafast processes, and ultra-high power densities. It highlights experimental, theoretical, and computational progress in nanoscale thermal transport, non-equilibrium ultrafast carrier dynamics, and thermal management in high-power devices. The Special Issue includes studies on enhanced optoelectronic nanofilms, silicon carbide thin-film growth on silicon substrates, improved epoxy nanocomposites, novel two-dimensional ferrovalley materials, and precise thermoelectric measurements of 2D nanomaterials. The article emphasizes the integration of materials innovation, interface engineering, multiscale simulation, and artificial intelligence as key pathways for future research and technological development in this field. [Extracted from the article] |
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| ISSN: | 19961944 |
| DOI: | 10.3390/ma19091910 |
