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Stable and flexible transparent conducting thin films enabled by TiO2/Ag nanowire/TiO2 composite structure.

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Title: Stable and flexible transparent conducting thin films enabled by TiO2/Ag nanowire/TiO2 composite structure.
Authors: Li, Yanfen1 (AUTHOR), Wangcheng, Hongyu1 (AUTHOR), Zhao, Le2 (AUTHOR), Yu, Shihui1,2 (AUTHOR) ysh728@126.com
Source: Ceramics International. May2026:Part A, Vol. 52 Issue 12, p19368-19375. 8p.
Subjects: Composite materials, Transparent electronics, Durability, Transparency (Optics), Electric conductivity, Chemical stability, Optoelectronics
Abstract: Flexible, transparent conducting thin films (TCFs) that simultaneously deliver high electrical conductivity, optical transparency, and environmental stability are essential for next-generation optoelectronic devices. Here, we present a scalable and room-temperature strategy to fabricate high-performance TiO 2 /Ag nanowire (Ag NW)/TiO 2 composite TCFs on flexible polyethylene terephthalate (PET) substrates using a simple layer-by-layer approach. The density of the Ag NW percolation network is precisely controlled by adjusting the number of spin-coating cycles, enabling systematic optimization of the trade-off between sheet resistance and optical transmittance. The optimized composite film achieves a sheet resistance of 9.6 Ω/□ at a visible transmittance of 86.1%, corresponding to a figure of merit of 260.9, surpassing typical ITO/PET counterparts. The amorphous TiO 2 cladding layers conformally encapsulate the Ag NW network without interrupting its percolation pathways, providing intimate interfacial contact and mechanical reinforcement. This encapsulation markedly enhances the durability and chemical robustness of the films, which retain stable conductivity after 1000 bending cycles (r = 5 mm), repeated adhesion tests, and 100 s of ultrasonication. Moreover, the TiO 2 encapsulation significantly improves environmental stability, effectively suppressing oxidation and corrosion during 85 °C/85% RH aging, H 2 O 2 immersion, and NaCl/Na 2 S chemical exposure by serving as a dense diffusion barrier against reactive species. This work establishes TiO 2 /Ag NW/TiO 2 composite TCFs as a promising platform for flexible optoelectronic devices, transparent heaters, and next-generation display technologies. [ABSTRACT FROM AUTHOR]
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Database: Engineering Source
Description
Abstract:Flexible, transparent conducting thin films (TCFs) that simultaneously deliver high electrical conductivity, optical transparency, and environmental stability are essential for next-generation optoelectronic devices. Here, we present a scalable and room-temperature strategy to fabricate high-performance TiO 2 /Ag nanowire (Ag NW)/TiO 2 composite TCFs on flexible polyethylene terephthalate (PET) substrates using a simple layer-by-layer approach. The density of the Ag NW percolation network is precisely controlled by adjusting the number of spin-coating cycles, enabling systematic optimization of the trade-off between sheet resistance and optical transmittance. The optimized composite film achieves a sheet resistance of 9.6 Ω/□ at a visible transmittance of 86.1%, corresponding to a figure of merit of 260.9, surpassing typical ITO/PET counterparts. The amorphous TiO 2 cladding layers conformally encapsulate the Ag NW network without interrupting its percolation pathways, providing intimate interfacial contact and mechanical reinforcement. This encapsulation markedly enhances the durability and chemical robustness of the films, which retain stable conductivity after 1000 bending cycles (r = 5 mm), repeated adhesion tests, and 100 s of ultrasonication. Moreover, the TiO 2 encapsulation significantly improves environmental stability, effectively suppressing oxidation and corrosion during 85 °C/85% RH aging, H 2 O 2 immersion, and NaCl/Na 2 S chemical exposure by serving as a dense diffusion barrier against reactive species. This work establishes TiO 2 /Ag NW/TiO 2 composite TCFs as a promising platform for flexible optoelectronic devices, transparent heaters, and next-generation display technologies. [ABSTRACT FROM AUTHOR]
ISSN:02728842
DOI:10.1016/j.ceramint.2026.03.034