View in EDS

Evaluating the selection process for optical sensor system configurations used in surface metrology applications.

Saved in:
Bibliographic Details
Title: Evaluating the selection process for optical sensor system configurations used in surface metrology applications.
Authors: Sokolov, Alexandr M.1 (AUTHOR) asokolov@astate.edu, Simpson, Travis1 (AUTHOR) travis.simpson@smail.astate.edu, Ahmed, Ifaz1 (AUTHOR) Ifaz.ahmed@smail.astate.edu
Source: Measurement (02632241). Jun2026, Vol. 280, pN.PAG-N.PAG. 1p.
Subjects: Interferometry, Ball grid array technology, Confocal microscopy, Optical sensors, Surface roughness measurement, Substrates (Materials science), Microfabrication
Abstract: • A comparative analysis of the performance of three surface metrology systems is conducted. • The attributes of the silicon wafer, the Ball Grid Array (BGA), and the substrate-bonded die are measured. • Different measurement systems are suitable for different cases. • White Light Interferometry performs best but requires higher measurement times. • A weighted decision matrix identifies optimal system configurations. Surface metrology is very crucial for precision manufacturing processes, especially in the semiconductor industry, to measure different characteristics of silicon wafers or a Ball Grid Array (BGA). Various surface metrology approaches are used for measurements processes. However, it is difficult to pinpoint which approach is suitable for a measurement process, as every approach has its own advantages and disadvantages. To address this issue, this study intends to represent a methodology that supports selecting the optimal optical measurement system by comparing multiple system configurations and performing physical measurements based on common types of surface metrology application requirements in the semiconductor industry. In this study, the selection process is outlined using process flow charts, and a comparative study is performed among three system configurations by physically measuring a silicon wafer, a BGA, and a substrate-bonded die on each system. descriptive statistics, Statistical Process Control (SPC) limits, and ANOVA were utilized to analyze the measurement data. In addition, a weighted decision matrix was created to help identify optimal system configurations. White Light Interferometry (WLI) technology performs best in terms of measurement precision, accuracy, and repeatability, but requires much longer measurement times. Even though the system utilizing chromatic confocal technology and a line sensor-type objective offered the fastest cycle time, it had the worst performance in terms of precision and accuracy. The insights of this study help in the different types of surface metrology practices in manufacturing facilities and research and development labs by determining the optimal measurement system configuration. [ABSTRACT FROM AUTHOR]
Copyright of Measurement (02632241) is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
Description
Abstract:• A comparative analysis of the performance of three surface metrology systems is conducted. • The attributes of the silicon wafer, the Ball Grid Array (BGA), and the substrate-bonded die are measured. • Different measurement systems are suitable for different cases. • White Light Interferometry performs best but requires higher measurement times. • A weighted decision matrix identifies optimal system configurations. Surface metrology is very crucial for precision manufacturing processes, especially in the semiconductor industry, to measure different characteristics of silicon wafers or a Ball Grid Array (BGA). Various surface metrology approaches are used for measurements processes. However, it is difficult to pinpoint which approach is suitable for a measurement process, as every approach has its own advantages and disadvantages. To address this issue, this study intends to represent a methodology that supports selecting the optimal optical measurement system by comparing multiple system configurations and performing physical measurements based on common types of surface metrology application requirements in the semiconductor industry. In this study, the selection process is outlined using process flow charts, and a comparative study is performed among three system configurations by physically measuring a silicon wafer, a BGA, and a substrate-bonded die on each system. descriptive statistics, Statistical Process Control (SPC) limits, and ANOVA were utilized to analyze the measurement data. In addition, a weighted decision matrix was created to help identify optimal system configurations. White Light Interferometry (WLI) technology performs best in terms of measurement precision, accuracy, and repeatability, but requires much longer measurement times. Even though the system utilizing chromatic confocal technology and a line sensor-type objective offered the fastest cycle time, it had the worst performance in terms of precision and accuracy. The insights of this study help in the different types of surface metrology practices in manufacturing facilities and research and development labs by determining the optimal measurement system configuration. [ABSTRACT FROM AUTHOR]
ISSN:02632241
DOI:10.1016/j.measurement.2026.121928