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Implementation of depth‐resolved Laue microdiffraction by wire profiling at the Shanghai Synchrotron Radiation Facility.

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Title: Implementation of depth‐resolved Laue microdiffraction by wire profiling at the Shanghai Synchrotron Radiation Facility.
Authors: Wang, You-Kang1,2 (AUTHOR), Yang, Yi-Ming1 (AUTHOR) yangym@ihep.ac.cn, Li, Run-Guang3 (AUTHOR), Yu, Dong-Hai3 (AUTHOR), Wang, Si-Sheng4 (AUTHOR), Wang, Zhi-Jun4 (AUTHOR), Liu, Peng1,5 (AUTHOR), Wang, Yan-Dong3 (AUTHOR) ydwang@ustb.edu.cn
Source: Journal of Applied Crystallography. Jun2026, Vol. 59 Issue 3, p923-931. 9p.
Subjects: Depth profiling, Synchrotrons, X-ray diffraction, Solids, Crystallography, Elastic deformation
Geographic Terms: China
Abstract: White‐beam X‐ray microdiffraction is a non‐destructive technique for probing microstructure and micromechanical behavior on the mesoscopic scale. Making use of the high throughput of Laue diffraction and advanced X‐ray focusing optics, this technique enables efficient point‐by‐point mapping of local crystal structure, lattice rotation and elastic strain with submicrometre spatial resolution. However, the deep penetration of X‐rays leads to a signal averaging effect along the beam path in bulk materials, which severely restricts further application of conventional microdiffraction. Herein, we report the successful implementation of differential aperture X‐ray microscopy on the standard Laue microdiffraction beamline (BL03HB) at the Shanghai Synchrotron Radiation Facility, China. Using a step‐scanned absorbing wire as a depth profiler for diffracted beams, the beamline is endowed with depth‐resolved analytical capability. We have also developed an efficient geometric parameter calibration method and screened a robust optimization algorithm for diffraction signal depth reconstruction via forward simulations. This implementation enabled the acquisition of depth‐resolved crystallographic information from a bulk silicon bimorph and a nickel‐based single‐crystal superalloy, with a depth resolution of <10 µm. These results lay a solid foundation for expanding the beamline's characterization capability from two‐dimensional surface analysis to three‐dimensional volumetric mapping of bulk materials. [ABSTRACT FROM AUTHOR]
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Database: Engineering Source
Description
Abstract:White‐beam X‐ray microdiffraction is a non‐destructive technique for probing microstructure and micromechanical behavior on the mesoscopic scale. Making use of the high throughput of Laue diffraction and advanced X‐ray focusing optics, this technique enables efficient point‐by‐point mapping of local crystal structure, lattice rotation and elastic strain with submicrometre spatial resolution. However, the deep penetration of X‐rays leads to a signal averaging effect along the beam path in bulk materials, which severely restricts further application of conventional microdiffraction. Herein, we report the successful implementation of differential aperture X‐ray microscopy on the standard Laue microdiffraction beamline (BL03HB) at the Shanghai Synchrotron Radiation Facility, China. Using a step‐scanned absorbing wire as a depth profiler for diffracted beams, the beamline is endowed with depth‐resolved analytical capability. We have also developed an efficient geometric parameter calibration method and screened a robust optimization algorithm for diffraction signal depth reconstruction via forward simulations. This implementation enabled the acquisition of depth‐resolved crystallographic information from a bulk silicon bimorph and a nickel‐based single‐crystal superalloy, with a depth resolution of <10 µm. These results lay a solid foundation for expanding the beamline's characterization capability from two‐dimensional surface analysis to three‐dimensional volumetric mapping of bulk materials. [ABSTRACT FROM AUTHOR]
ISSN:00218898
DOI:10.1107/S1600576726004073