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Design and electromechanical analysis of a novel Kirigami-patterned circuit substrate for high stretchability.

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Title: Design and electromechanical analysis of a novel Kirigami-patterned circuit substrate for high stretchability.
Authors: Yu, Ching-Feng1 (AUTHOR) cfyu@nuu.edu.tw, Ye, Zi-Hao2 (AUTHOR) qaz988756@gmail.com, Cheng, Hsien-Chie2 (AUTHOR) hccheng@fcu.edu.tw
Source: Engineering Computations. 2026, Vol. 43 Issue 6, p2450-2491. 42p.
Subjects: Electromechanical effects, Flexible electronics, Soft robotics, Polyimide films, Integrated circuit interconnections, Wearable technology, Finite element method
Abstract: Purpose: This study aims to enhance the stretchability and electrical stability of flexible silver interconnects by integrating Kirigami-inspired structures into Polyimide (PI) substrates. The goal is to establish quantitative design rules that address multi-directional mechanical loads in wearable and deformable electronics. Design/methodology/approach: A combined approach of experimental tensile testing, nonlinear finite element simulation, and response surface methodology is used. Screen-printed silver traces on Kirigami-patterned PI substrates are optimized by varying geometric and material parameters to reduce plastic strain and resistance variation. Findings: Wavy Kirigami slits significantly lower plastic strain without increasing electrical resistance. A 16-wave, 0.20 mm amplitude slit reduces strain to 3.53% under 15% elongation. An optimized layout achieves less than 10% resistance growth and below 6.3% strain in both X and Y directions. Originality/value: This work provides a comprehensive and validated design framework linking structural geometry with mechanical-electrical behavior. It offers practical design rules for stretchable electronics in wearable sensors and soft robotics, addressing real-world bidirectional deformation, a gap not sufficiently covered in prior studies. [ABSTRACT FROM AUTHOR]
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Database: Engineering Source
Description
Abstract:Purpose: This study aims to enhance the stretchability and electrical stability of flexible silver interconnects by integrating Kirigami-inspired structures into Polyimide (PI) substrates. The goal is to establish quantitative design rules that address multi-directional mechanical loads in wearable and deformable electronics. Design/methodology/approach: A combined approach of experimental tensile testing, nonlinear finite element simulation, and response surface methodology is used. Screen-printed silver traces on Kirigami-patterned PI substrates are optimized by varying geometric and material parameters to reduce plastic strain and resistance variation. Findings: Wavy Kirigami slits significantly lower plastic strain without increasing electrical resistance. A 16-wave, 0.20 mm amplitude slit reduces strain to 3.53% under 15% elongation. An optimized layout achieves less than 10% resistance growth and below 6.3% strain in both X and Y directions. Originality/value: This work provides a comprehensive and validated design framework linking structural geometry with mechanical-electrical behavior. It offers practical design rules for stretchable electronics in wearable sensors and soft robotics, addressing real-world bidirectional deformation, a gap not sufficiently covered in prior studies. [ABSTRACT FROM AUTHOR]
ISSN:02644401