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Design and electromechanical analysis of a novel Kirigami-patterned circuit substrate for high stretchability.

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Title: Design and electromechanical analysis of a novel Kirigami-patterned circuit substrate for high stretchability.
Authors: Yu, Ching-Feng1 (AUTHOR) cfyu@nuu.edu.tw, Ye, Zi-Hao2 (AUTHOR) qaz988756@gmail.com, Cheng, Hsien-Chie2 (AUTHOR) hccheng@fcu.edu.tw
Source: Engineering Computations. 2026, Vol. 43 Issue 6, p2450-2491. 42p.
Subjects: Electromechanical effects, Flexible electronics, Soft robotics, Polyimide films, Integrated circuit interconnections, Wearable technology, Finite element method
Abstract: Purpose: This study aims to enhance the stretchability and electrical stability of flexible silver interconnects by integrating Kirigami-inspired structures into Polyimide (PI) substrates. The goal is to establish quantitative design rules that address multi-directional mechanical loads in wearable and deformable electronics. Design/methodology/approach: A combined approach of experimental tensile testing, nonlinear finite element simulation, and response surface methodology is used. Screen-printed silver traces on Kirigami-patterned PI substrates are optimized by varying geometric and material parameters to reduce plastic strain and resistance variation. Findings: Wavy Kirigami slits significantly lower plastic strain without increasing electrical resistance. A 16-wave, 0.20 mm amplitude slit reduces strain to 3.53% under 15% elongation. An optimized layout achieves less than 10% resistance growth and below 6.3% strain in both X and Y directions. Originality/value: This work provides a comprehensive and validated design framework linking structural geometry with mechanical-electrical behavior. It offers practical design rules for stretchable electronics in wearable sensors and soft robotics, addressing real-world bidirectional deformation, a gap not sufficiently covered in prior studies. [ABSTRACT FROM AUTHOR]
Copyright of Engineering Computations is the property of Emerald Publishing Limited and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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Header DbId: egs
DbLabel: Engineering Source
An: 194519612
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: Design and electromechanical analysis of a novel Kirigami-patterned circuit substrate for high stretchability.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Yu%2C+Ching-Feng%22">Yu, Ching-Feng</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> cfyu@nuu.edu.tw</i><br /><searchLink fieldCode="AR" term="%22Ye%2C+Zi-Hao%22">Ye, Zi-Hao</searchLink><relatesTo>2</relatesTo> (AUTHOR)<i> qaz988756@gmail.com</i><br /><searchLink fieldCode="AR" term="%22Cheng%2C+Hsien-Chie%22">Cheng, Hsien-Chie</searchLink><relatesTo>2</relatesTo> (AUTHOR)<i> hccheng@fcu.edu.tw</i>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Engineering+Computations%22">Engineering Computations</searchLink>. 2026, Vol. 43 Issue 6, p2450-2491. 42p.
– Name: Subject
  Label: Subjects
  Group: Su
  Data: <searchLink fieldCode="DE" term="%22Electromechanical+effects%22">Electromechanical effects</searchLink><br /><searchLink fieldCode="DE" term="%22Flexible+electronics%22">Flexible electronics</searchLink><br /><searchLink fieldCode="DE" term="%22Soft+robotics%22">Soft robotics</searchLink><br /><searchLink fieldCode="DE" term="%22Polyimide+films%22">Polyimide films</searchLink><br /><searchLink fieldCode="DE" term="%22Integrated+circuit+interconnections%22">Integrated circuit interconnections</searchLink><br /><searchLink fieldCode="DE" term="%22Wearable+technology%22">Wearable technology</searchLink><br /><searchLink fieldCode="DE" term="%22Finite+element+method%22">Finite element method</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: Purpose: This study aims to enhance the stretchability and electrical stability of flexible silver interconnects by integrating Kirigami-inspired structures into Polyimide (PI) substrates. The goal is to establish quantitative design rules that address multi-directional mechanical loads in wearable and deformable electronics. Design/methodology/approach: A combined approach of experimental tensile testing, nonlinear finite element simulation, and response surface methodology is used. Screen-printed silver traces on Kirigami-patterned PI substrates are optimized by varying geometric and material parameters to reduce plastic strain and resistance variation. Findings: Wavy Kirigami slits significantly lower plastic strain without increasing electrical resistance. A 16-wave, 0.20 mm amplitude slit reduces strain to 3.53% under 15% elongation. An optimized layout achieves less than 10% resistance growth and below 6.3% strain in both X and Y directions. Originality/value: This work provides a comprehensive and validated design framework linking structural geometry with mechanical-electrical behavior. It offers practical design rules for stretchable electronics in wearable sensors and soft robotics, addressing real-world bidirectional deformation, a gap not sufficiently covered in prior studies. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Engineering Computations is the property of Emerald Publishing Limited and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
  BibEntity:
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 42
        StartPage: 2450
    Subjects:
      – SubjectFull: Electromechanical effects
        Type: general
      – SubjectFull: Flexible electronics
        Type: general
      – SubjectFull: Soft robotics
        Type: general
      – SubjectFull: Polyimide films
        Type: general
      – SubjectFull: Integrated circuit interconnections
        Type: general
      – SubjectFull: Wearable technology
        Type: general
      – SubjectFull: Finite element method
        Type: general
    Titles:
      – TitleFull: Design and electromechanical analysis of a novel Kirigami-patterned circuit substrate for high stretchability.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Yu, Ching-Feng
      – PersonEntity:
          Name:
            NameFull: Ye, Zi-Hao
      – PersonEntity:
          Name:
            NameFull: Cheng, Hsien-Chie
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 07
              Text: 2026
              Type: published
              Y: 2026
          Identifiers:
            – Type: issn-print
              Value: 02644401
          Numbering:
            – Type: volume
              Value: 43
            – Type: issue
              Value: 6
          Titles:
            – TitleFull: Engineering Computations
              Type: main
ResultId 1