Thermal Conductivity and Dielectric Properties of EP Composites Enhanced by BNNS-AgNP Synergistic Doping.
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| Title: | Thermal Conductivity and Dielectric Properties of EP Composites Enhanced by BNNS-AgNP Synergistic Doping. |
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| Authors: | Zhou, Haibin1 (AUTHOR), Deng, Jun1,2 (AUTHOR), Xie, Zhicheng1 (AUTHOR), Pan, Zhicheng1,2 (AUTHOR), Cui, Yanjie1 (AUTHOR), Yue, Dong2 (AUTHOR), Feng, Yu2 (AUTHOR), Zhang, Mingze2 (AUTHOR), Chi, Minghe2 (AUTHOR), He, Xunjun2 (AUTHOR) |
| Source: | Nanomaterials (2079-4991). Jun2026, Vol. 16 Issue 12, p704. 14p. |
| Subjects: | Thermal conductivity, Dielectric properties, Silver nanoparticles, Nanostructured materials, Epoxy resins, Filler materials, Electronic packaging, Electric insulators & insulation |
| Abstract: | To meet the growing demand for materials combing high thermal conductivity and electrical insulation, we developed epoxy (EP) composites filled with zero-dimensional (0D) silver nanoparticles (AgNPs) and two-dimensional (2D) boron nitride nanosheets (BNNSs). This hybrid filler system synergistically enhances both thermal conductivity and dielectric properties, while retaining excellent electrical insulation. With only 1 wt% AgNPs and 15 wt% BNNSs, the composite achieved a dielectric constant of 4.17 at 100 Hz, outperforming pure EP. At 30 wt% BNNSs and the same AgNP loading, the in-plane and out-of-plane thermal conductivities reached 3.02 and 0.41 W·m−1·K−1, respectively, along with improved thermal stability. Moreover, the composite exhibited an electrical conductivity below 10−9 S/cm at 1000 Hz, confirming that the minimal metal filler content negligibly affects insulation. Thus, this work offers a feasible strategy for designing next-generation high-performance composites using 0D/2D hybrid fillers, highlighting their promising potential for advanced electronic packaging. [ABSTRACT FROM AUTHOR] |
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| Database: | Engineering Source |
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| Abstract: | To meet the growing demand for materials combing high thermal conductivity and electrical insulation, we developed epoxy (EP) composites filled with zero-dimensional (0D) silver nanoparticles (AgNPs) and two-dimensional (2D) boron nitride nanosheets (BNNSs). This hybrid filler system synergistically enhances both thermal conductivity and dielectric properties, while retaining excellent electrical insulation. With only 1 wt% AgNPs and 15 wt% BNNSs, the composite achieved a dielectric constant of 4.17 at 100 Hz, outperforming pure EP. At 30 wt% BNNSs and the same AgNP loading, the in-plane and out-of-plane thermal conductivities reached 3.02 and 0.41 W·m−1·K−1, respectively, along with improved thermal stability. Moreover, the composite exhibited an electrical conductivity below 10−9 S/cm at 1000 Hz, confirming that the minimal metal filler content negligibly affects insulation. Thus, this work offers a feasible strategy for designing next-generation high-performance composites using 0D/2D hybrid fillers, highlighting their promising potential for advanced electronic packaging. [ABSTRACT FROM AUTHOR] |
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| ISSN: | 20794991 |
| DOI: | 10.3390/nano16120704 |
