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Thermal Conductivity and Dielectric Properties of EP Composites Enhanced by BNNS-AgNP Synergistic Doping.

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Title: Thermal Conductivity and Dielectric Properties of EP Composites Enhanced by BNNS-AgNP Synergistic Doping.
Authors: Zhou, Haibin1 (AUTHOR), Deng, Jun1,2 (AUTHOR), Xie, Zhicheng1 (AUTHOR), Pan, Zhicheng1,2 (AUTHOR), Cui, Yanjie1 (AUTHOR), Yue, Dong2 (AUTHOR), Feng, Yu2 (AUTHOR), Zhang, Mingze2 (AUTHOR), Chi, Minghe2 (AUTHOR), He, Xunjun2 (AUTHOR)
Source: Nanomaterials (2079-4991). Jun2026, Vol. 16 Issue 12, p704. 14p.
Subjects: Thermal conductivity, Dielectric properties, Silver nanoparticles, Nanostructured materials, Epoxy resins, Filler materials, Electronic packaging, Electric insulators & insulation
Abstract: To meet the growing demand for materials combing high thermal conductivity and electrical insulation, we developed epoxy (EP) composites filled with zero-dimensional (0D) silver nanoparticles (AgNPs) and two-dimensional (2D) boron nitride nanosheets (BNNSs). This hybrid filler system synergistically enhances both thermal conductivity and dielectric properties, while retaining excellent electrical insulation. With only 1 wt% AgNPs and 15 wt% BNNSs, the composite achieved a dielectric constant of 4.17 at 100 Hz, outperforming pure EP. At 30 wt% BNNSs and the same AgNP loading, the in-plane and out-of-plane thermal conductivities reached 3.02 and 0.41 W·m−1·K−1, respectively, along with improved thermal stability. Moreover, the composite exhibited an electrical conductivity below 10−9 S/cm at 1000 Hz, confirming that the minimal metal filler content negligibly affects insulation. Thus, this work offers a feasible strategy for designing next-generation high-performance composites using 0D/2D hybrid fillers, highlighting their promising potential for advanced electronic packaging. [ABSTRACT FROM AUTHOR]
Copyright of Nanomaterials (2079-4991) is the property of MDPI and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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DbLabel: Engineering Source
An: 194907423
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PubTypeId: academicJournal
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  Data: Thermal Conductivity and Dielectric Properties of EP Composites Enhanced by BNNS-AgNP Synergistic Doping.
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  Data: <searchLink fieldCode="JN" term="%22Nanomaterials+%282079-4991%29%22">Nanomaterials (2079-4991)</searchLink>. Jun2026, Vol. 16 Issue 12, p704. 14p.
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  Data: <searchLink fieldCode="DE" term="%22Thermal+conductivity%22">Thermal conductivity</searchLink><br /><searchLink fieldCode="DE" term="%22Dielectric+properties%22">Dielectric properties</searchLink><br /><searchLink fieldCode="DE" term="%22Silver+nanoparticles%22">Silver nanoparticles</searchLink><br /><searchLink fieldCode="DE" term="%22Nanostructured+materials%22">Nanostructured materials</searchLink><br /><searchLink fieldCode="DE" term="%22Epoxy+resins%22">Epoxy resins</searchLink><br /><searchLink fieldCode="DE" term="%22Filler+materials%22">Filler materials</searchLink><br /><searchLink fieldCode="DE" term="%22Electronic+packaging%22">Electronic packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Electric+insulators+%26+insulation%22">Electric insulators & insulation</searchLink>
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  Label: Abstract
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  Data: To meet the growing demand for materials combing high thermal conductivity and electrical insulation, we developed epoxy (EP) composites filled with zero-dimensional (0D) silver nanoparticles (AgNPs) and two-dimensional (2D) boron nitride nanosheets (BNNSs). This hybrid filler system synergistically enhances both thermal conductivity and dielectric properties, while retaining excellent electrical insulation. With only 1 wt% AgNPs and 15 wt% BNNSs, the composite achieved a dielectric constant of 4.17 at 100 Hz, outperforming pure EP. At 30 wt% BNNSs and the same AgNP loading, the in-plane and out-of-plane thermal conductivities reached 3.02 and 0.41 W·m−1·K−1, respectively, along with improved thermal stability. Moreover, the composite exhibited an electrical conductivity below 10−9 S/cm at 1000 Hz, confirming that the minimal metal filler content negligibly affects insulation. Thus, this work offers a feasible strategy for designing next-generation high-performance composites using 0D/2D hybrid fillers, highlighting their promising potential for advanced electronic packaging. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
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  Data: <i>Copyright of Nanomaterials (2079-4991) is the property of MDPI and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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        Value: 10.3390/nano16120704
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      – Code: eng
        Text: English
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        PageCount: 14
        StartPage: 704
    Subjects:
      – SubjectFull: Thermal conductivity
        Type: general
      – SubjectFull: Dielectric properties
        Type: general
      – SubjectFull: Silver nanoparticles
        Type: general
      – SubjectFull: Nanostructured materials
        Type: general
      – SubjectFull: Epoxy resins
        Type: general
      – SubjectFull: Filler materials
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      – SubjectFull: Electronic packaging
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      – SubjectFull: Electric insulators & insulation
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      – TitleFull: Thermal Conductivity and Dielectric Properties of EP Composites Enhanced by BNNS-AgNP Synergistic Doping.
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              M: 06
              Text: Jun2026
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