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Tribological, mechanical and electrochemical properties of nanocrystalline copper depositsproduced by pulse electrodeposition.

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Bibliographic Details
Title:	Tribological, mechanical and electrochemical properties of nanocrystalline copper depositsproduced by pulse electrodeposition.
Authors:	Song ST Tao, D DYL Li
Source:	Nanotechnology. Jan2006, Vol. 17 Issue 1, p65-78. 14p.
Subjects:	Atomic force microscopy, Mathematical optimization, Metallic composites, Nanocrystals
Abstract:	Nanocrystalline metals and alloys with grain sizes smaller than 100 nm have attractedextensive interest due to their improved mechanical, physical and chemical properties.Although electrodeposition has been one of the methods for synthesizing nanocrystallinematerials, properties of nanocrystalline electrodeposits are less evaluated, especially fortribological applications or potential applications in nanoscale devices such asMEMS and NEMS. In this work, nanocrystalline and microcrystalline copperdeposits were produced by pulse and direct current electrodeposition processesrespectively. Effects of deposition parameters, such as the peak density, frequency,current-on time and current-off time of the pulse current (PC), on the grain size wereinvestigated for the purpose of process optimization. The grain size of nanocrystallinecoatings was determined using x-ray diffraction and atomic force microscopy (AFM).Mechanical and tribological properties of the deposits were investigated usingnanoindentation, nanoscratch and microscratch techniques. It was demonstrated that thenanocrystalline film was markedly superior to regularly grained film made by direct current(DC) plating; the nanocrystalline deposit shows higher hardness, lower frictioncoefficient and lower wear rate. The surface electron stability and chemical reactivityof the deposits were also evaluated by measuring their electron work function(EWF). Results indicate that the nanocrystalline surface is more electrochemicallystable than the DC-plated one. This increased stability result is attributed to theformation of a stronger and more adherent passive film on the nanocrystallinecopper, confirmed by potentiodynamic polarization and electrical contact resistancemeasurements. [ABSTRACT FROM AUTHOR]
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Database:	Engineering Source

Description
Abstract:	Nanocrystalline metals and alloys with grain sizes smaller than 100 nm have attractedextensive interest due to their improved mechanical, physical and chemical properties.Although electrodeposition has been one of the methods for synthesizing nanocrystallinematerials, properties of nanocrystalline electrodeposits are less evaluated, especially fortribological applications or potential applications in nanoscale devices such asMEMS and NEMS. In this work, nanocrystalline and microcrystalline copperdeposits were produced by pulse and direct current electrodeposition processesrespectively. Effects of deposition parameters, such as the peak density, frequency,current-on time and current-off time of the pulse current (PC), on the grain size wereinvestigated for the purpose of process optimization. The grain size of nanocrystallinecoatings was determined using x-ray diffraction and atomic force microscopy (AFM).Mechanical and tribological properties of the deposits were investigated usingnanoindentation, nanoscratch and microscratch techniques. It was demonstrated that thenanocrystalline film was markedly superior to regularly grained film made by direct current(DC) plating; the nanocrystalline deposit shows higher hardness, lower frictioncoefficient and lower wear rate. The surface electron stability and chemical reactivityof the deposits were also evaluated by measuring their electron work function(EWF). Results indicate that the nanocrystalline surface is more electrochemicallystable than the DC-plated one. This increased stability result is attributed to theformation of a stronger and more adherent passive film on the nanocrystallinecopper, confirmed by potentiodynamic polarization and electrical contact resistancemeasurements. [ABSTRACT FROM AUTHOR]
ISSN:	09574484
DOI:	10.1088/0957-4484/17/1/012